Electronics Forum | Tue Jun 12 20:59:14 EDT 2001 | ianchan
Hi mates, actually my whole problem, is whether to : 1) To offset the heat-absorb ability of the Pallet, that artifically lowers my pcba temperature, is it advisable to artifically increase the overall, oven zone temperatures? offset by estimated +
Electronics Forum | Fri Mar 19 13:26:19 EST 1999 | Scott Cook
| Hi folks, | | I am looking for inputs on a long-standing problem encountered in our shop: Bottom-side parts (passives) falling off in the Wave...where the only remnants of the part is a flattened glue dot of proper diameter and volume, and somet
Electronics Forum | Fri Mar 27 12:59:22 EDT 2015 | ppcbs
That is a strange task. I must ask what is the purpose? When performing BGA Rework the goal is to recreate the manufacturing process of using the reflow oven. It is important to have even heat of the BGA and PCB from top to bottom. Using top heat o
Electronics Forum | Sat Mar 28 06:59:03 EDT 2015 | robertwillis
I would agree with the comments so far its much better to have some pre heat. You have not explained why bottom side preheat is a problem. Even having some input will help balance the process. Assume there is some thing on the back side that is a pro
Electronics Forum | Tue Jun 12 09:30:42 EDT 2001 | Rob Fischer
I assume the material you are using is black. This may sound far fetched but try using a lighter color material. Going from black to gray has given users as much as fifteen degrees F. less in heat loss.
Electronics Forum | Tue Jun 12 11:28:30 EDT 2001 | CPI
Rob: Wouldn't that only apply to IR ovens. If using a true convection oven the color of the material wouldn't hinder output at all "Right". Don�t want to see someone spend money on new tooling if unnecessary.
Electronics Forum | Sat Jun 09 00:53:34 EDT 2001 | ianchan
Hi Folks, My Production runs a uBGA-liken product, and uses Pallets to support the 0.8mm thick pcb, during the SMT + reflow oven process. Process/QA see occurs: 1) 0402 unsolder? 2) 0402 tombstone? 3) "uBGA" poor-visual joints (dry joints)? Took
Electronics Forum | Sun Jun 10 12:30:10 EDT 2001 | procon
Is this a Convection Oven or IR? If convection, you can increase the air velocity in the zones if the oven has this ability. You should do as Dave has explained. If you must use pallets when reflowing your components, you need to profile in the same
Electronics Forum | Tue Jun 12 20:36:00 EDT 2001 | ianchan
Hi mates, thanks for the interest on this topic, just to share info to clarify any queries : 1) am using light blue-grey materials for the Pallet 2) am using Hot Air Convection Reflow Oven 3) I suspect its due to the Pallet materials properties, t
Electronics Forum | Sun Apr 10 14:08:29 EDT 2005 | greg
Hi there I have a question about reflow oven for Pb-free technology. I've noticed that some of the manufactures offer reflow ovens with short (26-30 lenght in cm) heat zones others offer longer more then 30 cm. So there are ovens with total heat len
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