Electronics Forum | Mon Jul 29 16:43:55 EDT 2002 | mcm4me
I have a customer with up to 8% scrap from one board supplier and 1% from another supplier for solder dewett and no wet over ENIG finish with mask defined pads. Initially I suspected mask residue on pads because of the no wets but I have come to find
Electronics Forum | Fri Sep 17 03:03:29 EDT 2010 | grahamcooper22
Hi Gani, looking at the HASL icture and the poor wetting of the solder over the pads I would imagine that the HASL coating is very thin on the pads and in actual fact isn't 'solder' but is tin /copper intemetallic and this has poor solderability. It
Electronics Forum | Mon Jan 29 06:44:59 EST 2001 | Scott B
I have recently come across a device which has a palladium over nickel finish which when soldered shows evidence of poor wetting to the lead ( i.e. a wetting angle greater than 90�) about three quarters of the way up the side of lead. This is only vi
Electronics Forum | Mon Jan 29 12:42:24 EST 2001 | davef
Several points about your query are: * TI�s solderability protection specification is a minimum of 3 u" of palladium over 40-60 u" of nickel plate over a http://www.ti.com/sc/docs/products/logic/package/palladm/index.htm
Electronics Forum | Tue Jul 17 10:25:59 EDT 2007 | hussman
You want to know which flux will over come thermal mass problems? That's easy - none.
Electronics Forum | Tue Jul 30 08:37:39 EDT 2002 | davef
When you talk about 'poor wetting', 'dewett', 'no wets', etc.; are you seeing solder pulling back or away from the pad? Please describe the condition. Dewetting. The condition in the solder joint in which the liquid solder has not adhered intimate
Electronics Forum | Thu May 19 12:50:19 EDT 2005 | splice1
Hi Hoss, Thanks for your reply. Yes I am seeing the flux flood over to the top surface of my board, so to an extent I am not concerned with the fluxer. I believ that the foam fluxer is functioning adequately.
Electronics Forum | Mon Apr 23 19:12:23 EDT 2001 | relensky
Thanks for the instructions. I was missing the reflow part... Omikron is the method our board house offers. We have been through the plating thickness problem and tin depletion conditions. Beyond those issues, I have been trying a few different n
Electronics Forum | Fri Mar 07 15:07:50 EST 2003 | davef
YiEng, MA/NY DDave: Usually when the gold plating bath goes south, you loose solderability.
Electronics Forum | Sun Mar 09 19:55:56 EST 2003 | iman
Which specific title books from under your pen, would you recommend for the avid process reader/learner? specific - talking about info/process/data wealth books, and not which books give the most royalties *grinz*
