Electronics Forum: over-baking (Page 1 of 1)

Over baking BGA- ?

Electronics Forum | Wed Feb 15 09:16:55 EST 2006 | der

thanks for that Ger.

Over baking BGA- ?

Electronics Forum | Wed Feb 15 04:25:56 EST 2006 | der

one of the guys was baking a 672BGA . he mistakenly left the oven on over night so instead of baking for 12 hours at 125 degrees C, they got baked for 24 hours. Is there any detrimental impact on the BGAs or are they just well baked???

MSL | Baking components after expired floor life

Electronics Forum | Thu Sep 15 17:44:15 EDT 2022 | decaire

I agree with Evtimov that sticking with the J-Std-033 is preferable to creating your own procedure at a different temp, especially if you need to pass an audit since the auditors will compare your process to the J-Std. My understanding is that oxida

Moisture Sensitive Device over baked

Electronics Forum | Fri Feb 15 02:49:35 EST 2002 | nifhail

What are the consequences of having the Moisture sensitive component to be overbaked. Say if the specs. calls for 125 C +/- 5 C for 48 hours, but they components were accidently left in the oven during a weekend, wih the oven still operating, to make

PCB Burned after reflow?

Electronics Forum | Wed Mar 04 10:36:10 EST 2009 | milroy

Hi If you mean your PCB stayed in the Reflow oven more than the reflow time required for the solder paste specs then I suggest to throw away the board because it would lead over heated solder joints all over the board. Think what could happen to an

Moisture Sensitive Device over baked

Electronics Forum | Fri Feb 15 08:33:59 EST 2002 | fmonette

The joint IPC/JEDEC standard currently specifies a limit of one bake cycle, regardless of the temprature or duration. In the proposed revision this will be replaced by a maximum cumulative duration of 48 hours at 125C. The reason identified for thi

Over baking BGA- ?

Electronics Forum | Wed Feb 15 09:00:46 EST 2006 | GS

if you look at the J-STD-033B, you will see that such a large PQFP could stay even longer the 24h at 125�C even if internally is already totally dry. It could be, the balls can get oxided and also IMC (Inter metallic compounds) could grow avery littl

Pin Hole Issue after Reflow Soldering - Passive Components

Electronics Forum | Mon Dec 25 08:43:35 EST 2017 | arjunkolavara

Hi , We are having Pin hole issues on the passive locations in the board after the SMT reflow process. Details: PCB surface Finish : ENIG . Solder paste : Alpha OM338 – M13 / Indium SMQ92J Location : Its Random and more on passive components. {

MSL/MSD Tracking

Electronics Forum | Thu Aug 21 16:33:49 EDT 2008 | decaire

The 2 most common approaches for MSD Tracking and Control on the factory floor are: 1) Manual paper-based procedures (Example: Log Sheet or Label that the operator must fill out and pay attention to) - or - 2) Software-based tracking system (Example

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