Electronics Forum: overheated joint in smt (Page 1 of 4)

via in smt pad

Electronics Forum | Fri Mar 26 17:12:17 EST 2004 | ben

I have recently encountered a new pcb design with a very high density of components on either side of the pcb. One of the suggested "fixes" is to use the smt pads as vias i.e. the via will be drilled thorough the centre of the smt pad. My concern i

"Gap" in completed solder joint between lead and pad

Electronics Forum | Thu Nov 30 16:10:05 EST 2006 | Hussman

Wow, why all the anger? This gap you guys are talking about is measured as "G" in IPC/EIA J-STD-001 (Chunks was there, but she failed to read the fine print). And almost all parts that measure G follow Note 3 which states "Properly wetted fillet s

Re: acceptable defect rates for smt process, in ppm.

Electronics Forum | Tue Jan 18 20:31:10 EST 2000 | WDavidson

It makes a difference what the normalizer is. We calculate solder ppm and placement ppm separately for each assembly. Solder ppm = #solder defects*1E6/(Qty boards*#solder joints per board). For us this number is easily less than 50 and sometimes

Re: acceptable defect rates for smt process, in ppm.

Electronics Forum | Mon Jan 17 12:16:02 EST 2000 | Brian W.

My old company (CM) ran SMT to 50ppm including some very complex boards. We established the normalizer number by: #components + #solder joints. As was stated earlier, the ppm for any given product is the result of many factors. You may get differen

solder joint crack in post thermal cycling test at Dye & Pry

Electronics Forum | Tue Apr 13 08:21:05 EDT 2010 | esca

Hi manchella, After ATC test, two different failure modes can be present: solder FATIGUE (into bulk) or BRITTLE INTERMETALLIC fracture. So, first you have to verify this. Moreover, which brand of SMT paste have you used ? The crack into solder joint

Voiding in uBGA's w/blind uvia's in pads

Electronics Forum | Tue Nov 20 12:48:40 EST 2001 | tony_sauve

We recently experienced a problem w/voids (up to 65%) in uBGA solder joints. The only joints that have the problem correlated to pads which had blind 0.006" via's in them. The via's only extend down 2 layers, of the 18. 21 BGA's on the PCB, only expe

Via Failure in Field

Electronics Forum | Thu Jan 07 15:28:52 EST 2010 | cbart

did the boards get built by hand or via smt process (through reflow oven)? Someone asked earlier if some one touched up the adjacent joint. The answer to that question is yes. Look at how the solder tails off the smt pad away from that joint! I suspe

voids in solder

Electronics Forum | Thu Mar 01 11:43:08 EST 2001 | dason_c

Not enough info, when you say no clean flux, is it for wave soldering process, please provide more detail, SMT or wave, is it all the joint which you find the void? Rgds

blowholes in SMT process

Electronics Forum | Fri Mar 20 05:07:16 EDT 2009 | rocko

Hi All, I was puzzled because of terrible blowholes in solder joints of gold plated odd-form components. I am very confused because all other components on the boards have perfect solder joints. Here are some process details: 1) Solder paste: N

Voids in solder fillet

Electronics Forum | Thu Apr 17 16:43:09 EDT 2003 | davef

Background: * Bulwith, Ronald A., �Failure Analysis of Solder Joints�, �Insulation/Circuits� magazine, February 1978 * Banks, Donald R., et al., �The Effects of Solder Joint Voiding on Plastic Ball Grid Array Reliability�, Proceedings of the Technica

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