Electronics Forum: oxidants (Page 7 of 90)

How to remove Oxides from older components? Fine Pitch

Electronics Forum | Wed Jul 29 10:46:04 EDT 2009 | babe7362000

I was wondering if anyone knows the best way to clean oxides off of fine pitch components? Apparently the paste we use does not have strong enough flux to remove the oxides off of the leads of the components. I have validated the profile and that i

Board oxidation... should I belive...?

Electronics Forum | Thu Apr 18 19:00:06 EDT 2013 | jorge_quijano

Hola.. I have several PCBs with some kind of oxidation, my supplier has told me that there is no problem with that oxidation, it will have no effet on soldering and press fit processes, PCBs were received 1 year ago, but they are well packaged and h

can silver plating be used as barrier when soldering brass to copper? silver plate the brass?

Electronics Forum | Thu Jun 08 11:37:44 EDT 2017 | jkitt84

davef, thanks for feedback. I talked with a plater who said they put copper before silver when plating brass. Would a complete stack of: Brass part, then 0.0001-0.0002" of copper, then 0.0005" of silver, then Tarniban anti oxidation. Sound reasonabl

SAC305 preforms not wetting to ENIG pad in fluxless process

Electronics Forum | Mon Apr 26 17:09:05 EDT 2021 | kwalker

Sounds like you are getting oxidation of the nickel under the gold layer. If the gold is porous it will allow the nickel underneath to oxidize, which is the dark dull layer you are seeing, and why when you apply flux it solders just fine - the flux i

Re: Solderability on Immersion Gold

Electronics Forum | Thu Mar 02 07:40:46 EST 2000 | Roni Haviv

Allmost forgot: The "black pad" is simply the oxidized Nickel.

Re: Solderability on Immersion Gold

Electronics Forum | Thu Mar 02 07:40:46 EST 2000 | Roni Haviv

Allmost forgot: The "black pad" is simply the oxidized Nickel.

Info on OSP PCB�s

Electronics Forum | Wed Apr 23 08:35:54 EDT 2003 | davef

Over time, copper in the via will form an oxide with oxygen in the air.

Re: Skiming Dross From Solder Pot

Electronics Forum | Tue Nov 09 17:26:13 EST 1999 | Dave F

Horace: You weren't real specific about the set-up of the two machines. So what's the diff man?? Big dross generators are: 1 R Woodgate says that pump speed is the biggest driver to dross production 2 Chrys uses low dross cast bar: Alpha HiFlo 3

Re: Dross characteristic

Electronics Forum | Sat Oct 09 03:26:58 EDT 1999 | Brian

| Always experiencing dross in pot with different characteristic such as color, shape, dry/wet etc. Any paper, wetsites provide the more comprehesive explanation on its characteristic | Dross is a mixture of various things. The obvious ones are met

Bare Copper Pad Reflow Soldering

Electronics Forum | Thu Jul 29 23:21:51 EDT 1999 | CH Lee

I received a request from customer to assemble ceramic substrate (alumina oxide)that printed with a low temperature Copper thick film conductor (the overglaze layer is polymer). The Copper pads are exposed without any coating. This ceramic substrate


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