Electronics Forum: oxidation on smd components (Page 1 of 5)

orientation of polarised smd components on reels/tapes

Electronics Forum | Sat Jul 23 09:19:17 EDT 2016 | dalpets

I want to place smd's by hand from tape strips using a vacuum pump. What is the orientation of polarised smd components on reels/tapes? Is there a standard manufacturing orientation, or are there variations? I understand some manufactures have part

orientation of polarised smd components on reels/tapes

Electronics Forum | Sat Jul 23 18:16:31 EDT 2016 | ttheis

This information is normally available in the component's data sheet (typically toward the end where the packaging is detailed.)

orientation of polarised smd components on reels/tapes

Electronics Forum | Fri Jul 29 13:42:38 EDT 2016 | gregp

The standard you need is EIA-481B. It details the taping of components from 8mm tape up to 200mm tape including component orientations. 8, 12, 16 and 24mm tape has the sprocket holes only on one side so it is easy to determine the proper orientatio

orientation of polarised smd components on reels/tapes

Electronics Forum | Mon Jul 25 09:11:25 EDT 2016 | spoiltforchoice

There 2 main rival standards for orientation in tape and because you can't really trust manufacturers to stick to one or the other or something else entirely it is always wise to check the datasheet. Typically an SOIC will have pin 1 the same end as

Oxidation on termination of smd chip capacitor

Electronics Forum | Thu Apr 19 02:49:07 EDT 2007 | ray

I observed some black dot or some oxidation occured on chip termination on pcba reflowed fews weeks ago as buffer stock. The solder joint and fillet wetting is good and shinning. It is an acceptable or defect condition per IPC standard/requirement? W

Crystalization on TI QFP and other fine pitch components

Electronics Forum | Thu Oct 28 11:50:11 EDT 2010 | phase1

We are having a little trouble with what appears to be a crystalization between our fine pitch parts. The problem appears after a a thourough wash of the pcb when dry. It looks like lead wiskers/haze between the joints.We are using water soluable lea

Nonwetting Components - why won't components wet to solder?

Electronics Forum | Thu Jan 25 12:18:40 EST 2007 | wagoner

There are several smd components in our factory that don't reliably wet to solder during reflow. Paste and placement are good, but the component won't wet reliably. All of the other components on the boards solder fine, but one of these components

Oxidation on BGA

Electronics Forum | Tue Apr 20 20:11:58 EDT 2004 | davef

First, how oxidized are these solder balls? Will the take solder using your routine flux / paste? Second, on restoring solderability, the three basic methods you can use to restore solderability on components are: * Highly active fluxes in a retinn

Non-wettig on chip cap.

Electronics Forum | Mon Dec 10 04:15:01 EST 2001 | Beny

Thanks for your advise Now I don't found Non-wetting defect at TIN COATED 0603 after I had increased peak temp and Time above 183 C. At film caps, I still found Non-wetting in high rate at film chip size 2416. I using PANASONIC's part with identif

Removing Green Masking on PCB's

Electronics Forum | Fri Jun 15 13:17:27 EDT 2001 | CPI

Are you exposing so you can solder and SMD component directly to it? If not are there ant vias near by that connect to the area you are trying to expose? If not I have done as Dave suggested using a dremal tool. Messy but it works.

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