Electronics Forum | Mon Oct 09 10:58:26 EDT 2006 | Matt Smith
Over the past several months we have experienced intermittent problems with wave solder voids on PCBs coated with OSP. We suspect variation in the OSP application process, or oxidation of the surface due to insufficient or degraded OSP. Is there a me
Electronics Forum | Wed Jul 08 16:28:25 EDT 2020 | duchoang
OSP board finish is the issue. With OSP microBGA board, we need to have enough paste (enough flux) on pads (small pads on BGA), also we need to have strong, more activate flux to get rid of Preservative layer on top of pads. In this case, the OSP did
Electronics Forum | Thu Oct 14 16:38:29 EDT 2021 | SMTA-64387687
OSP is there to keep the copper from oxidizing. Once you wash the board, the copper is exposed. So, you have to either use it right away, or store it in a non-oxygen environment (vacuum/nitrogen).
Electronics Forum | Wed Jul 17 11:52:54 EDT 2002 | tmarc
Hello all, I have a question about OSP. The solder mask over traces leading to SMT pads, in some instances, does not cover all the way to the pad. Of course the stencil apertures do not include traces. After the SMT and reflow process, there is visib
Electronics Forum | Fri Sep 03 04:00:10 EDT 2010 | sachu_70
James, Are you referring to oxidation caused on outer layers of PCB on account of poor OSP finish over Cu?
Electronics Forum | Wed Jan 13 04:07:58 EST 2016 | crystalpcb
Hi Syed, I'm a PCB engineer from China. First:Immersion gold surface finish is the best for PCBs. Second:HASL(Lead-Free HASL) Then:HAL(with lead) The cheapest surface finish is OSP(After 15 days will be oxidized)
Electronics Forum | Fri Jan 07 09:56:04 EST 2005 | davef
Electroformed stencil suppliers follow. The describe the stencil production process on their sites. * Aplpha Metals [ http://www.alphametals.com/products/ stencils/pdf/PG_Electroform_Stencils.pdf ] * Chepaume [ http://www.chepaume.com/electroforming
Electronics Forum | Tue Apr 22 14:53:22 EDT 2003 | Robert
OK...I'm hooked on this subject. Were changing from NiAu to OSP as a "savings" and not because we choose too. So far we have had great success with BGA and are working on TSOP, SOP, etc. The only thing we have come to dislike so far is the ring aroun
Electronics Forum | Fri Jul 30 16:02:49 EDT 1999 | Earl Moon
| | I received a request from customer to assemble ceramic substrate (alumina oxide)that printed with a low temperature Copper thick film conductor (the overglaze layer is polymer). The Copper pads are exposed without any coating. | | This ceramic su
Electronics Forum | Wed Feb 23 19:04:19 EST 2000 | Jason Nipper
Hi Mike, I have had problems in the past that were very difficult to determine the source of. Our tombstoning issues were caused by the plating on the part itself. If your smd placement, x-y positioning and placement pressure is not an issue, and
winsouce.jpg)
