Electronics Forum | Fri Jun 17 13:51:21 EDT 2011 | mosborne1
Your problem is at your board house with the finish. There is not enough tin deposited on the ground plane. Could be the current density too low on the ground plane. If electroless they just didn't process these correctly. What is the finish suppose
Electronics Forum | Wed Jun 08 13:49:48 EDT 2011 | sonofptolemy
Hello, I am having a problem with HASL PCB's after it comes back from the stuffer. To me it looks like oxidation and it causes poor wetting. This leads to a bunch of problems all of which have different symptoms but the cause is this oxidation proble
Electronics Forum | Fri Sep 18 11:23:32 EDT 2009 | isd_jwendell
I know nothing about Xbox specific rework, but have a lot of experience with PCB repairs. "...maybe think its a bad idea now not knowing what im doing" Don't get discouraged, it's a learning process. If it was that easy everyone would be doing it.
Electronics Forum | Sat Oct 19 08:33:50 EDT 2002 | johnw
The whole thread seem's to have gone off track. Russ we've been doing a fairly big bit of work on the whole BGA voidign thing as we were so unhappy with the answer's that we were getting from around the industry, basically no one really kows all the
Electronics Forum | Mon Feb 23 23:24:13 EST 1998 | Craig Fernandes
Can anyone give me any info on the effective removal of BGA's? I need to be able to take a variety of BGA's off boards quickly without creating pad damage. I am not yet concerned about the re-attach process.
Electronics Forum | Sun Oct 20 12:49:11 EDT 2002 | johnw
Dave, I've had a few intersting conversations with Dr Lee, now there's a guy who know's stuff, but as it turn's out even he doesn't have all the answers on why things void. Many of his papers point towards oxides or contamination on the ball, so age
Electronics Forum | Mon Sep 30 09:26:04 EDT 2002 | itempea
Russ, first step would be to get IPC-7095 on BGAs. A few notes: There can be voids in solder balls, or at the solder joints to the BGA, or at the solder joints to the PCB. Various sources or reasons can be responsible for these voids. Voids can be
Electronics Forum | Wed Jan 19 14:32:37 EST 2005 | esoderberg
Short of buying a closed look wash system, what other machines/processes are available for localized removal of flux that is not operator intensive. already familiar with Branson ultrasonics and just washing in alcohol but what else is out there?
Electronics Forum | Thu Feb 26 10:33:01 EST 2015 | emeto
Take a look at articles that explain underfill process and how to remove/rework underfill: http://www.finetechusa.com/rework/applications/underfill-rework.html http://www.circuitnet.com/experts/86535.shtml
Electronics Forum | Thu Oct 30 09:09:30 EST 2003 | alandra516
Contact Process Sciencies at 512 259-7070 and talk to Steven Schoppe. He can help you with that problem
winsouce.jpg)