Electronics Forum | Mon Oct 02 14:46:06 EDT 2023 | davef
Lab tests can confirm the composition of your material. I'm going with tin oxide. Tin oxide changes color depending on the thickness of the deposit. Your deposit is fairly thin. It will change to a brown color as the thickness increases. Your EDX
Electronics Forum | Fri Jun 12 06:53:54 EDT 1998 | Earl Moon
| I am looking at purchaseing a full convection bench top oven from OK Industrys. (Model JEM-310) | It seems to have all the features that we will need for low volume production runs. | It has a Nitrogen input option, and I am intrested if anyone on
Electronics Forum | Fri May 03 18:55:41 EDT 2002 | davef
Interesting situation. Everything [ie, intermetallic compounds, solderability, etc] is speculative without knowing more about the materials of: * Leads. * Solderability protection. ... because suppliers use a fairly wide of materials. Your suppl
Electronics Forum | Wed Dec 10 10:05:07 EST 2003 | davef
We do not have experience soldering to the PVD surface you plan to use. We use Titanium [Ti] stiffeners in wave soldering and our wave equipment manufacturer uses Ti fingers, nozzles, pump blades, and other parts, because solder doesn�t stick to Ti.
Electronics Forum | Mon Nov 27 17:47:23 EST 2000 | Dave F
Gyver: Lemme take a wack [if you�ll excuse the expression, given direction of the later discussion] at your questions. Q1. Will the baking of BGA or PCB cause more oxidation before the SMT process? A1. It certainly will not cause less oxidation,
Electronics Forum | Mon Oct 12 08:07:45 EDT 1998 | Earl Moon
| I have datas to substain that a not wetting PCB ( the HAL oxided or not uniform in thickness )if soldered in reflow, it shows voids with X-Ray inspection.The voids are in side all the joints not only on the solder pads levell. | | Is there a techn
Electronics Forum | Thu Jul 29 15:35:05 EDT 1999 | Earl Moon
| | While inspecting incoming PCBs we detected around all plated-through-holes (only there and all in the same place) some halfmoonshaped light rings that match obviously only with the pink ring symptom shown in the IPC-A-600 chapter 2.5.2.. That wou
Electronics Forum | Fri Jul 30 14:50:26 EDT 1999 | Kevin Hussey
| I received a request from customer to assemble ceramic substrate (alumina oxide)that printed with a low temperature Copper thick film conductor (the overglaze layer is polymer). The Copper pads are exposed without any coating. | This ceramic substr
Electronics Forum | Tue Dec 01 10:25:54 EST 1998 | Earl Moon
| | | All y'll: I could use your input on determining when to skim dross from a wave solder pot. | | | | | | On one hand, dross protects the surface of the solder from oxidation. On the other hand too much dross may affect solder joint quality. O
Electronics Forum | Fri May 17 15:53:47 EDT 2002 | davef
Based on what you�ve said, comments are: * There is no reason not to expect a trace of Zn in your 85/15 Sn/Pb solderability protection, but Sn/Cu IMC are more prevalent than Zn. * Intermetallic growth and oxidation are very different materials proper
