Electronics Forum: package problem (Page 1 of 74)

Anyone facing QFN package crack problem ?

Electronics Forum | Tue Nov 27 20:51:18 EST 2007 | chs

Anyone can share experience on package crack for QFN package. This package is so sensitive to any external force. Any good recomendation on desoldering / rework procedure.

Anyone facing QFN package crack problem ?

Electronics Forum | Sun Dec 02 20:02:23 EST 2007 | chs

Hi, There are QFN 32,40,48 pins with middle pad. Body size are 7x7 and pitch 0.5mm. I means as compared to 2 sided package, QFN are easily damaged by external mechanical / thermal force. Phenomenon observed are mold cap open which further caused wire

Anyone facing QFN package crack problem ?

Electronics Forum | Wed Nov 28 20:03:36 EST 2007 | chs

Hi, Thanks for the info. You mentioned about TQFP, how about QFN, which is leadless and one sided package compared to TQFP ? Actually, we are component manufacturer. Recently we have multiple customer come back with issue of electrical failure on par

Anyone facing QFN package crack problem ?

Electronics Forum | Fri Nov 30 19:39:51 EST 2007 | mika

Hi chs, What type of QFN or MLF package are we talking about? Assuming there is a middle thermal pad? Body Size & no. of terminals & pitch? What about your statement: "This package is so sensitive to any external force". Can you please explain what y

Anyone facing QFN package crack problem ?

Electronics Forum | Wed Nov 28 16:08:38 EST 2007 | jmelson

I've been using Xilinx TQFP's in the 44 and 144 lead sizes with no trouble. I don't even bake them before reflow and have never had any problem. The Xilinx parts are certainly NOT sensitive, I could not break one with my bare hands if I tried (I ha

Anyone facing QFN package crack problem ?

Electronics Forum | Thu Nov 29 16:00:03 EST 2007 | jmelson

Desoldering often applies a LOT more heat and thermal stress to the part, and maybe mechanical forces while everything is hot, to get the part free of the board. So, a lot of damage might be done there, making post-mortem harder. Without the leads,

SMT package types

Electronics Forum | Wed Oct 30 09:28:50 EST 2002 | gregp

How about your designator actually contains size info in a code. For example, SO14-237-050-090. That is "package type" - "width" (over leads) - "lead pitch" - "thickness". The problem with this is a great deal of thought has to be put in before comm

Mydata package libraries

Electronics Forum | Tue Oct 24 13:07:54 EDT 2006 | CL

Hello Billy, We have 6 machines tied to a server. I can see where this would be a problem. Basically, the answer is you would need a package for every significantly different package that you are placing. I don't think you can just say 3 0805 packag

Mydata package libraries

Electronics Forum | Tue Oct 24 13:41:25 EDT 2006 | jax

Everybody who uses basic "part-type" naming conventions for machine package codes will have this same issue unless restrictions are placed on who, how, and when the package codes can be altered. Some alternative methods to solving this problem: 1. U

Component solderability problems TO263 package

Electronics Forum | Fri Aug 04 04:26:31 EDT 2000 | Charles stringer

I am experiencing a problem when soldering down a TO263 package. The device has a large solderable tab (approx 8mm square)on the back and 5 leads. Sometimes the leads are not soldered to the board properly. I am using a metal mask with 9 "windows" of

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