Electronics Forum | Mon Aug 18 09:28:04 EDT 2008 | eyalg
The following standard is used to determine warpage: "High Temperature Package Warpage Measurement Methodology" JESD22B112
Electronics Forum | Thu Jan 21 15:24:18 EST 1999 | Terry Burnette
| I have received prototype PBGA (256 pins) devices from | Motorola (actual part number = KXPC850ZT50). These parts seemed very warped on the edges. When I put the part on a plain surface, it rocks quite a bit when I press lightly on a corner. I h
Electronics Forum | Fri May 04 18:27:34 EDT 2001 | chpark
BGA warpage combined with PCB warpage can lead significant process yield loss. First, it is possible that major portion of BGA's apparent warpage is, in fact, coming from the PCB warpage. Assuming that the warpage is solely from BGA itself, I think
Electronics Forum | Wed Mar 02 05:14:07 EST 2005 | ABHI
Guys, Solder paste height worries all of us as we encounter the non wets after reflow. More so in fine pitch QFP's. The non wets are not always caused by solder paste height. Many other contributors. Even the pad geometry on te board can contribute t
Electronics Forum | Tue Dec 23 07:49:10 EST 2014 | robertwillis
the most common reason can be popcorning of the device or warpage of the packages during reflow. the distacnce from the boatom of the device is decreased hence the solder shorts. Trying doing some measurements on the package during simulated reflow.
Electronics Forum | Wed Oct 20 10:41:22 EDT 1999 | Eric Lerz
Our company (assembler and user) has experienced some board problems relating to warpage and solderability. The manner in which they are packaged by our fabricators and stored in our stock prior to assembly has been questioned (as one of many factor
Electronics Forum | Mon May 27 12:14:35 EDT 2002 | arcandspark
I use the exact same paste flux that we use in our solder paste for SMT manufacturing with great success. I have also had great success using the Air Vac DRS Hot Gas units with the same size BGA's. If to much heat is applied to fast to the BGA be it
Electronics Forum | Thu Mar 18 16:39:14 EST 2004 | Jed Johnson
A few good points have been made here: The profile could be ramping too fast. The profile could be gettting too hot. The profile may need to have more "soak" time before reflow to allow the board temperatue to equalize and the board to "relax" and st
Electronics Forum | Sun Apr 03 10:07:40 EDT 2005 | davef
In 2001, IVF evaluated the reliability of IBM CBGA and CCGA, i.e. packages with "hard" balls and columns, in space applications for the European Space Agency. One clear result was that amount of solder paste printed on the solder lands is very critic
Electronics Forum | Tue Apr 29 11:18:16 EDT 2008 | julienvittu
basically your problems come from the copper balance top and bottom side we are using substrate down to 0.18mm (semiconductor industry/ Bga package / SIp business) you have to respect 5% difference maximum between Top and bottom side otherwise you
