Electronics Forum | Sat Feb 18 09:20:09 EST 2012 | davef
The 3-Tier PCB library concept was originally created by IEC (International Electromechanical Commission) in 1999 and introduced to IPC in 2000. The concept had to be created as a solution for high density packaging for hand held devices to ruggedize
Electronics Forum | Mon Mar 21 12:02:09 EST 2005 | Rob
Hi Colin, Are you using the 1206 package with 4 elements or one of the higher density smaller packages? With the first type you can get them in both Convex or Concave terminations, with most of the solderability problems associated with using the C
Electronics Forum | Thu Nov 09 22:21:18 EST 2006 | John S.
I would think it would be more productive to compare DPMO. Particularly across different products. A simple board of 20 components should yield much higher than a complex board of 200 components. Also, some consideration should be given to the dif
Electronics Forum | Fri Jan 18 18:19:38 EST 2008 | arun2382
Is normal DI rinse cycle enough to wash away all residue after SMT assembly of high density substrate? This substrate would later be over molded to form MCM module package and I am seeing delamination in high density areas of the substrate at MSL3
Electronics Forum | Fri Mar 14 23:41:11 EST 2003 | MA/NY DDave
Hi Well maybe someone else has better info yet I don't see this fully associated with density of package. As long as the process gives a good Electroless NI, Immersion AU you should be OK. If it doesn't and the process output is marginal as has been
Electronics Forum | Fri Dec 01 12:40:04 EST 2000 | Dason C
I agreed with PeteC to use the selective wave pallet, please aware TSSOP is classify as MSL 3. The advantage of the surface mounting allow both package body size and thickness to decrease but also increase the density of the package. Direct heating
Electronics Forum | Mon Dec 18 14:49:23 EST 2000 | Charles Harper
Probably the most important recent event has been the acquisition of International Flexible Technologies by Scheldahl,whose strength in flexible materials will have a major growth impact for flexible circuits--already growing nicely.Also,continuing a
Electronics Forum | Fri Feb 28 11:02:06 EST 2020 | slthomas
I'm not 100% sure which type of gold you're asking about, but if you're talking about hard gold plating, I think the most common use is to provide a durable surface for things like membrane switch contacts because it resists abrasion and other mechan
Electronics Forum | Mon Jul 22 18:00:49 EDT 2002 | davef
It doesn't appear to be a proprietary mix. Maybe it's 'neither Alpha Metals nor Kester WILL [want to] supply it.' It's interesting. A lot of the discussion of a solder replacement for 63/37 has centered on high temperature alloys. In real life,
Electronics Forum | Tue Jan 04 10:00:19 EST 2005 | Carmichael
No mystery there... The balls are reflowed by conduction of heat from the package itself and the backside preheater just as in any other rework machine. The laser is just another method of precisely heating the entire package. The advantage is overa
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