Electronics Forum | Tue Sep 27 15:58:01 EDT 2011 | ck_the_flip
We use exclusively pneumatic feeders and can NOT control the force or speed of advancement. We get a lot of components (mostly LED-type packages) that tend to flop around in the pocket a lot and are flipped on the side or “thrown” by the feeder duri
Electronics Forum | Thu Nov 03 01:14:12 EDT 2016 | soniyaphilip
I am not familiar with FUJI CP4-3 machine . This makes a together package FUJI IP3 . This equipment makes a different sub equipment . I think each onne is important for data manipulation. It control the real-time production data from the MCS controll
Electronics Forum | Wed Sep 20 10:42:05 EDT 2000 | Erick Russell
Process control for Photonic soldering is based on the actual temperature of the component being reworked. If the desired temperature of the component for your process is 200C then that is the process temperature programmed. This is achieved by a cl
Electronics Forum | Mon Jul 15 12:54:28 EDT 2002 | kenbliss
Hi James If I understood you correctly, you have this problem also but you acknowledge its not the component vendor making the mistake it is purchasing not ordering soon enough in the right package or accepting whatever they can get. I would think
Electronics Forum | Thu Feb 11 07:24:40 EST 2016 | truewanderer
I'm planning to design the pcb of my project. The controller used is having 136 pins and the package is P-LFBGA. So i think i need to design a 6 layer board for better performance. I haven't designed a multi layer board before. So what are things tak
Electronics Forum | Wed Jan 09 01:22:39 EST 2019 | kenneth0
Hi Simond, The baking process is likely to remove any moisture after the cleaning process. We wouldn't want any moisture trapped as this might cause delamination if the package is subject to subsequent heating/reflow process. Hence there's a staging
Electronics Forum | Thu Oct 15 14:35:44 EDT 1998 | Joseph Belmonte
Hi Folks, As I travel our industry it seems to me the trend is to move from finner and finner pitch QFP's to array packages (BGA's, CSP's, etc.). Do you folks see the same trend? What is the finest pitch QFP package you have used in your process? Are
Electronics Forum | Thu Feb 08 11:39:51 EST 2001 | slthomas
Any adhesive tape, or stuff that uses it in packaging, like radial and axial parts. Ever try to get 5 year old 1/2 watt resistors to hold still in an axial sequencer dispense head? Yeesh.
Electronics Forum | Thu Jan 03 14:12:45 EST 2002 | davef
I know fmonette has a MSD audit check list. Maybe when he posts, he'll give us a MSD control procedure aimed at operations types.
Electronics Forum | Thu Sep 22 10:51:16 EDT 2005 | Rob
Stick a label on the package with the initial opening time and date & the use by time, then check before using again. Use the disposable indicator cards - if the are attached top the waffle packs they are getting the same exposure. Get your supplie
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