Electronics Forum | Thu Jan 27 20:34:12 EST 2000 | Dave F
Ashok: The real concern about moisture sensitivity is in plastic packaged parts. The plastic packaging used to manufacture surface mount technology devices absorb moisture from the environment. The high temperatures involved in vapor phase/reflow
Electronics Forum | Thu Sep 23 10:11:15 EDT 1999 | Earl Moon
| Hi All, | | I'm recently receiving an IC in package for Ic's sensitive to moisture and not in another times, Somebody know how can I know if this Is moisture sensitive or not(which is the rule ?)?. the Ic is a soic14. | | | thanks | | I appreci
Electronics Forum | Sat Oct 29 12:53:34 EDT 2011 | dontfeedphils
We had the same motor problem with our My12, whenever we would get the sound we would go through and slow down X accel speed in any packages and the placement accuracy as well. After doing this for quite a while we finally tried updating the motor c
Electronics Forum | Fri Feb 25 10:23:46 EST 2000 | K3 Equipment
Greg, If you are having a problem, i would first check board manufacturers process. Also are they shipping boards to you in seal packages (a must if you are in a humid part of the country.) Most of the time with a few simple process controls moistur
Electronics Forum | Wed Feb 09 09:34:03 EST 2000 | JAX
If you are talking about failure analysis and machine utilization information try looking at CIMCIS. They have a wide variety of products that can help. You might not even need their services, most SMT equipment has software packages that will allre
Electronics Forum | Fri Feb 25 10:23:46 EST 2000 | K3 Equipment
Greg, If you are having a problem, i would first check board manufacturers process. Also are they shipping boards to you in seal packages (a must if you are in a humid part of the country.) Most of the time with a few simple process controls moistur
Electronics Forum | Sat May 24 00:43:59 EDT 2003 | iman
Our engineers did a study on our medical product with 1mils standoff height, and one issue was 100% of the boards that underwent ultrasonic failed due to failure of the package wirebonding. Poor reflow control would be one area to review in any event
Electronics Forum | Thu Sep 22 09:04:29 EDT 2005 | gavinscott
The main problem that we have is the packaging for the MSD's can be opened and re-sealed a number of times before it hit's production, then it is opened again to be loaded into the machine and most of the time these parts are not consumed so they are
Electronics Forum | Thu Sep 07 11:01:52 EDT 2006 | davef
BGA cracking is caused by mechanical stress. This may be the result of: * Rough handling of soldered board * Inadequate consideration during package design of CTE effects on BGA * Poor control of or selection of thermal ramp rates during soldering
Electronics Forum | Mon Dec 04 20:57:09 EST 2006 | callckq
Hello, I did EDX on BGA just to find out copper wt% at the package- ball interface. Is wt% ranging from 20 to 32 considered as normal?? As far as I know lead free BGA and solder paste just have little copper..Where is this excess copper come from
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