Electronics Forum | Mon Jan 08 17:32:47 EST 2007 | Board House
Hi Oswald, Shelf life with ENIG if vacuum sealed and kept in controled enviroment would be 12 to 14 months. Shelf life in shrink wrap - No recomended packaging, 6 moths. If Shelf life goes over the 12 -14 months - Baking ? I would not suggest re-b
Electronics Forum | Wed Nov 12 04:34:17 EST 2008 | kywl
Hi all, Assuming that i were to design a PCB and there are multiple components, what is the minimum spacing required to ensure that i won't have problems in my SMT process later on? Also, is there a minimum component stand-off height spec as well?
Electronics Forum | Tue Sep 30 12:09:45 EDT 2014 | tech1
If you are running a Mydata machine why don't you try one of the new stick magazines they offer. These magazines shake rather than vibe and the motion is controlled by the package dimensions. Call your rep and see if you can "borrow" one to try out.
Electronics Forum | Tue Feb 16 13:58:02 EST 2016 | tsvetan
this document http://www.latticesemi.com/view_document?document_id=671 may be good start point but note that how to escape from the BGA is not big deal, how to route your filtering capcitors, grounding, impedance control lof you high speed signals ar
Electronics Forum | Mon Jan 04 18:29:06 EST 1999 | Mike Zurn
| | Does anyone have any experience with vibration testing of BGA packages and assemblies? We are starting to design BGA's into some of our products and we have not found very much information on vibrational test results. Any information will be he
Electronics Forum | Thu Mar 18 16:39:14 EST 2004 | Jed Johnson
A few good points have been made here: The profile could be ramping too fast. The profile could be gettting too hot. The profile may need to have more "soak" time before reflow to allow the board temperatue to equalize and the board to "relax" and st
Electronics Forum | Sun Apr 03 10:07:40 EDT 2005 | davef
In 2001, IVF evaluated the reliability of IBM CBGA and CCGA, i.e. packages with "hard" balls and columns, in space applications for the European Space Agency. One clear result was that amount of solder paste printed on the solder lands is very critic
Electronics Forum | Wed Mar 14 00:34:46 EDT 2007 | pyramus
Hi Muhammad thanks for the reply. However, this is my current situation. We are currently using some BGA's with this kind of packaging BGA over BGA. I have verified solderability of the main BGA (below Bga the one w/c will be soldered to PCB) using
Electronics Forum | Wed Jul 31 17:36:32 EDT 2002 | davef
Basically you need to do two things 1 Look at and print drawings you get. 2 Keep track of where those drawing are stored. LOOKING AT AND PRINTING DRAWINGS YOU GET. Use: * Same software that your customer used to create the drawing. [Oh, lots of cu
Electronics Forum | Thu Oct 26 13:26:53 EDT 2000 | ptvianc
Hello: 1. Yes, it is necessary to reball a PBGA after removal from the board. Once the part has been removed, the quantity of solder on the balls is out of control. This condition will not only result in an unacceptable variation in solder quantity
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