Electronics Forum | Mon Oct 11 13:44:29 EDT 1999 | Dave F
Ken: Since Earl is no longer here, I guess I'll bite on this. Your questions are very broad and difficult to answer specifically. So, I'll give you broad and non-specific answers. | Hi, | | We are using mixed technology in our PCBA. Would like to
Electronics Forum | Wed Aug 12 18:26:16 EDT 2020 | SMTA-64387117
Looking for engineers to test new desiccant technology and compare with Silica Beads. Samples provided. Additionally, engineer can work with and collaborate with "engineers only" group lead by US Military engineer for packaging. The goal is to d
Electronics Forum | Fri May 29 07:17:02 EDT 2015 | anirudh_thabjul
Hiee everyone, I am a Hardware Engineer and also a PCB designer. I am using a Microntroller which is in "CHIP PACKAGE". So in order to connect our microcontroller with my PCB, i am using "Wire bonding Technology". So, Can any one suggust 1. whi
Electronics Forum | Thu Jan 06 09:01:53 EST 2005 | Indy
go to the web site of "Lamina Ceramics". They have proprietary packaging technology for LED packaging. Indy
Electronics Forum | Mon Aug 13 12:03:50 EDT 2007 | davef
Test results indicated that the life of lead-free solder at a 2512 chip resistor could be worse than of SnPb solder in the accelerated thermal cycling condition. [Development of Life Prediction Model for Lead-free Solder at Chip Resistor, Changwoon H
Electronics Forum | Sat Jul 29 09:10:16 EDT 2006 | davef
Ball Grid Array (BGA). A surface mount technology leadless package with the connectors to the board placed in an array on the bottom of the package. They are attached to the board with tiny balls of solder placed on each contact. Pin Grid Array (P
Electronics Forum | Tue Sep 07 16:58:16 EDT 2004 | davef
Au contraire, mon ami. Although there is not "BGA" solderability test specified in J-STD-002A, the Test S can be used to assess solderability on BGA packages. [Joint Soldering Technology Committee ]
Electronics Forum | Wed Nov 28 08:42:19 EST 2001 | davef
Contact Cemal Basaran at the University at Buffalo Electronic Packaging Laboratory http://www.packaging.buffalo.edu. They develop Laser inspection technologies and use Moire Interferometry that may be able to do the things you want to do.
Electronics Forum | Mon Jan 31 21:11:09 EST 2000 | Dave F
Dave: Find: "Comprehensive Surface Mount Reliability Model Covering Several Generations of Packaging and Assembly Technology", by J. Clech et.al. IEEE Trans on Comp. Hyb. and Manuf. Tech. Vol. 16, No. 8 Dec. 1993, p.949. It listed cycle to failure
Electronics Forum | Tue Jun 02 17:52:06 EDT 1998 | Dave F
| Is there someone who can tell me where I can buy rolls of leader tape for SMT component tapes. Is there a good way of bonding leader tapes, maybe a special instrument to do the job. Thanks for any help. Igmar: The following companies supply SMT co
DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD is a company which mainly provide used and new SMT parts, provide repair SMT key parts service,new/used SMT machine trading,SMT consumables and Peripherals equipment,Clean room, ESD..
Manufacturer's Representative / Manufacturer / Equipment Dealer / Broker / Auctions / Distributor / Consultant / Service Provider
3th, Tangchang 3rd Road, Hengli, Dongguan City
Dongguan, China
Phone: 008615629932323
