Electronics Forum | Wed Aug 22 21:42:54 EDT 2007 | davef
Questions are: * Do these pads take solder? How well? * Have you stripped the gold and evaluated the condition of the nickel?
Electronics Forum | Mon Aug 27 08:03:32 EDT 2007 | davef
Actually, you will be soldering and wire bonding to the palladium layer, so we should have asked if you checked that layer, rather than the nickel. We not sure of the source of the copper that your see on EDX. It's possible copper from the pad migra
Electronics Forum | Thu Aug 23 09:52:38 EDT 2007 | d0min0
Hi, in past we had an issue with ENIG surface, black was Ni that get pass the Au - but it was discovered after reflow (SnPb) and the IC was losing contact with Cu tracks...at customers application :| Reason was as I remember too thin Au sufrace... w
Electronics Forum | Sun Aug 26 11:27:12 EDT 2007 | vangogh
Hi Davef, Thanks for the reply. There seem to be no issues on SMT reflow based on some samples done. We have not stripped the gold yet. We did a X-section+EDX and we are seeing traces of copper on the nickel layer. Any idea what is the implication of
Electronics Forum | Thu Aug 30 09:49:32 EDT 2007 | blnorman
EDS @ 10kV maybe going too deep. I've talked to a surface science physicist that recommends Auger spectroscopy because it's more of a true "surface" examination tool.
Electronics Forum | Tue Aug 21 05:05:52 EDT 2007 | vangogh
Hi All, I would like to get some inputs regarding this.... I have bare PCB which were stored with kapton tape attached on the Au plated pads. These were stored for close to a year. Upon removal of kapton tape, we noticed discolorations on the edges o
Electronics Forum | Tue Jul 10 03:51:49 EDT 2007 | vangogh
Hi All, We are producing PCBA with COB process. We are using kapton tape to protect the COB pads from solder splashes/stains. Questions: 1) Is kapton tape an industry accepted way of protecting gold pads from solder splashes? 2) What are the chance
Electronics Forum | Tue Jul 10 07:22:48 EDT 2007 | davef
Q1. Is kapton tape an industry accepted way of protecting gold pads from solder splashes? A1. No. It is more accepted to resolve the reason behind the solder splats, so that the added labor and cost of taping is eliminated. Search the fine SMTnet Arc
Electronics Forum | Mon Mar 17 07:00:34 EDT 2008 | ectan5117
Hi, During SMT process, i found that solder splash on the gold pad. The distance between the COB pad with component pad is about 1.25mm. My question is what material can used to cover the COB pad without bringing contamination. And i am welcome to
Electronics Forum | Thu Mar 20 08:45:02 EDT 2008 | davef
Common methods use to protect pads from solder splatter are: * No residue Kapton tape * Nonionic solder mask
