Electronics Forum | Mon Mar 23 16:38:09 EDT 2020 | emeto
Steve, On 16mil pitch I would try 12mil diameter on 5mil stencil, unless the BGA ball size is something unexpectedly huge.
Electronics Forum | Fri Mar 27 03:42:17 EDT 2020 | sssamw
Did you try 0.12 or 0.1mm nano coated stencil @ 10 mil aperture? A soak time type profile with long reflow time could help.
Electronics Forum | Tue Mar 24 10:34:03 EDT 2020 | slthomas
My experience with our process is that those parameters would result in a big bridging problem. I'm working with a stencil designer at our fabricator on an asymmetrical aperture design that hopefully balances forces enough to keep the parts centered.
Electronics Forum | Wed Mar 02 18:23:57 EST 2022 | proceng1
In my experience, take whatever the manufacturer tells you the minimum keep away area is and double that for standard use. I'm not saying it can't do what they say, but no matter how precise the software, the motor control, the lead screws and rails
Electronics Forum | Tue Sep 22 13:14:27 EDT 1998 | Chrys
| We are getting into a lot of double sided boards offlate. Our customer is loading a lot of RNETS, Diodes ( MINLS, SOT23s and other 2 leaded diodes ). We are processing it through a traditional glue process and wave soldering the SMT parts along wit
Electronics Forum | Wed Feb 08 09:43:08 EST 2023 | charles_nguyen
Thank you for the above information but what I want to talk about is the PCB design aspect. Should there be any warning about it in the DFM?
Electronics Forum | Thu Feb 02 10:10:20 EST 2023 | tommy_magyar
Perhaps google this, as you will find very interesting articles. For scientific explanation look up solder fatigue on Wikipedia with references added. A more in depth explanation you can find on the Digikey forum where you will find other people like
Electronics Forum | Fri Sep 07 11:46:29 EDT 2018 | dleeper
Air gap on the PCB is determined the pad spacing which in turn is governed by the component. As long as the PCB designer is following the typical BGA layout best practices; i.e no open via in pad, non-solder mask defined pads, solder mask covered tra
Electronics Forum | Thu Sep 06 05:25:38 EDT 2018 | spoiltforchoice
I'm no expert but I think you will find the majority of discussions around BGA & good printing results focus on the PCB design and things like tented vias and pad definition. e.g https://macrofab.com/blog/bga-pad-creation-smd-nsmd/ After that, work
Electronics Forum | Mon Aug 06 14:12:49 EDT 2018 | tey422
I just found out we are unable to epoxy it. As the customer need to pull it up and open to tune the product. Which means the only way to solve it is by fine tune the pad and/or stencil design.
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