Electronics Forum | Wed Jan 27 04:01:46 EST 2016 | slouis2014
Thanks alot for the info
Electronics Forum | Fri Dec 04 23:15:45 EST 2015 | mac5
You say that there is no green solder mask around the lands of the BGA only silk screen. If that is the case I would be concerned about the solderabilty of the component if the silk screen gets onto the pads. The application of solder mask is much mo
Electronics Forum | Fri Dec 20 12:12:12 EST 2002 | russ
Thanks Dave, I was looking in the Murata data base and couldn't even find the part (Even though they are the ones making it)let alone the pad dims. This part looks like it could be fun anyway. Russ
Electronics Forum | Fri Dec 04 05:47:57 EST 2015 | rushpcbuk
In PCB design, a BGA (Ball Grid Array) package typically determines the number of layers that a Printed Circuit Board should have. However, the 4-layer board with a BGA package is commonly used than a 2-layer than an 8-layer PCB. On the other hand, t
Electronics Forum | Mon Nov 30 08:39:05 EST 2015 | spoiltforchoice
http://blog.screamingcircuits.com/2010/09/smd-vs-nsmd.html such as this? Which handily also tells you what you might want to google.
Electronics Forum | Wed Dec 02 20:41:13 EST 2015 | slouis2014
Thanks for the link. Their is a white silkscreen underneath the BGA instead of a green soldermask. Attached is a picture of the BGA. Does these affect the solderability for the component.
Electronics Forum | Fri Dec 20 10:13:38 EST 2002 | davef
The total inductance of a chip capacitor is determined both by its length to width ratio and by the mutual inductance coupling between its electrodes. So, a 1210 chip size has a lower inductance than a 1206 chip. Check with your supplier for recomm
Electronics Forum | Wed Nov 10 02:20:07 EST 1999 | Marc
The padsfor large heat sinks are being designed on our boards with large copper ground planes surrounding them by our engineers. I am having great difficulty keeping the reflow temperature below 230 degrees in order for the temperature of the copper
Electronics Forum | Mon Apr 21 08:55:35 EDT 2003 | russ
The pads you use for Reflow will be be fine for handsolder. Russ
Electronics Forum | Mon Jun 02 16:33:35 EDT 2008 | operator
Is there some good resources (.pdfs, websites, articles) that someone can point me to regarding design for bga footprints? I need to brush up on thermal relief design for bga footprints. I got a customer whose bga lands are masking defined on top of
