Electronics Forum | Mon Jun 28 10:17:44 EDT 2004 | davef
People like flat surfaces for placing and reflowing certain components, like fine pitch devices. Some board suppliers can supply HASL that is flat and well controlled from an amount of material stand-point. Unlike OSP, HASL has a wonderful shelf-li
Electronics Forum | Mon Apr 16 09:58:55 EDT 2007 | davef
"Although some lead-free pastes performed adequately and newer pastes work better than earlier formulations, this detailed experiment confirmed that tin/lead solder pastes wet back to PCB pads better than lead-free solder pastes. Therefore, a more ac
Electronics Forum | Mon Apr 09 12:52:00 EDT 2018 | slthomas
We are about to do a second iteration of something we struggled mightily with last time and I'm hoping to at least make a step in the right direction. There are 12 of these parts on the board and virtually all of them required removal and replacemen
Electronics Forum | Wed Jun 23 15:49:30 EDT 1999 | Kelly Morris
In the IPC-SM-782 (Surface Mount Design and Land Pattern Standard) it recommends a minimum of .040" between bottomside wavesoldered chip pads. Where might I find a similar IPC recommendation for minimum space between thru-hole pads? Does anyone kno
Electronics Forum | Wed Jun 23 18:23:32 EDT 1999 | Tom B.
Even though you may find a pad-pad thru-hole spacing, part body size, orientation, and insertion head tooling clearences may be the deciding factor in spacing. 1. Part body diameter will dictate component centroid spacing. ---[][][][
Electronics Forum | Wed Sep 07 00:28:04 EDT 2011 | woodsmt
I have identified a Board design issue and having trouble convincing others of my findings. I have a BGA (Sn63 balls, +1500 IO, 0.6mm ball, 1mm pitch, with heat spreader plate)that has a high incidence of solder shorting on the corners. The board i
Electronics Forum | Fri Feb 07 16:10:14 EST 2003 | MA/NY DDave
Hi Gee, It seems funny to comment on your own post. I notice that the original poster and a respondent, like me, are striving to create some voiding by design to improve the way this joint will form. NEAT!! I still think that those vias as DaveF p
Electronics Forum | Fri Dec 27 14:11:18 EST 2002 | cnotebaert
We have placed these parts. I have not had problems with them but when I designed the stencil we reduced the app for the large thermal by 20% to reduce the chance of problems like your having. If the balls are close (.040-.050" or
Electronics Forum | Tue Feb 26 07:55:23 EST 2002 | cyber_wolf
I know that there is an IPC spec. for board pad size design for BGA components. After a little research we have found that recommendations vary from component manufacturers to board houses. (These recommendations are different than what IPC says....
Electronics Forum | Tue Feb 26 08:02:30 EST 2002 | cyber_wolf
I know that there is an IPC spec. for board pad size design for BGA components. After a little research we have found that recommendations vary from component manufacturers to board houses. (These recommendations are different than what IPC says....)
