Electronics Forum | Fri Sep 03 03:56:41 EDT 1999 | Wolfgang Busko
| We've noticed that there are many different recommendations for pad sizes for various SMT parts. This seems to vary wildly from manufacturer to manufacturer for the same case sizes. Is there any standards that can used used to specify these sizes
Electronics Forum | Fri Sep 03 14:37:45 EDT 1999 | JohnW
| | We've noticed that there are many different recommendations for pad sizes for various SMT parts. This seems to vary wildly from manufacturer to manufacturer for the same case sizes. Is there any standards that can used used to specify these siz
Electronics Forum | Mon Sep 06 19:59:59 EDT 1999 | armin
| | | We've noticed that there are many different recommendations for pad sizes for various SMT parts. This seems to vary wildly from manufacturer to manufacturer for the same case sizes. Is there any standards that can used used to specify these s
Electronics Forum | Fri Jul 28 08:51:50 EDT 2006 | russ
Are all these defects related to the trace that enters pad? Looking at #2, the good fillet has side trace entry and the bad has front entry. I would suggest that a profile check is in order, then the paste would be next culprit. Russ
Electronics Forum | Thu Jul 14 01:08:30 EDT 2005 | pyramus
I too experience it too component being blown out of the pad also using heller 1800. In my case I also did check entry and exit of reflow so far no obtruction. Also checked profile setting also ok. Mine is a 0603 Chip capacitor... but problem is o
Electronics Forum | Mon Apr 19 21:37:17 EDT 2021 | ouaret
dear all, update: we got that the calibration of SIM is the problem, the distance between SIMs need to be calibrated. can someone help us get the manual that describe on how to calibrate the SIMs? we have a problem with our cyberoptics AOI machine
Electronics Forum | Mon Aug 30 04:08:51 EDT 1999 | Earl Moon
| | Planning to evaluate the above process... | | Can anyone can give me some tips/infos on the above.... | | e.g. stencil aperture design, aperture ratio, common problems and solutions they encountered on the above process, is the profile different
Electronics Forum | Mon Aug 30 11:20:12 EDT 1999 | John Thorup
| | | Planning to evaluate the above process... | | | Can anyone can give me some tips/infos on the above.... | | | e.g. stencil aperture design, aperture ratio, common problems and solutions they encountered on the above process, is the profile diff
Electronics Forum | Mon Aug 30 12:02:16 EDT 1999 | Brian Wycoff
| | | | Planning to evaluate the above process... | | | | Can anyone can give me some tips/infos on the above.... | | | | e.g. stencil aperture design, aperture ratio, common problems and solutions they encountered on the above process, is the profil
Electronics Forum | Tue Aug 31 03:37:19 EDT 1999 | Wolfgang Busko
| | | | | Planning to evaluate the above process... | | | | | Can anyone can give me some tips/infos on the above.... | | | | | e.g. stencil aperture design, aperture ratio, common problems and solutions they encountered on the above process, is the
