Electronics Forum | Tue Feb 26 10:42:48 EST 2002 | davef
Consider the hierarchy presented in http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=18112
Electronics Forum | Tue Feb 26 07:55:23 EST 2002 | cyber_wolf
I know that there is an IPC spec. for board pad size design for BGA components. After a little research we have found that recommendations vary from component manufacturers to board houses. (These recommendations are different than what IPC says....
Electronics Forum | Tue Feb 26 08:02:30 EST 2002 | cyber_wolf
I know that there is an IPC spec. for board pad size design for BGA components. After a little research we have found that recommendations vary from component manufacturers to board houses. (These recommendations are different than what IPC says....)
Electronics Forum | Wed Jul 20 13:28:02 EDT 2005 | Theo Doucakis
I am looking for some guidance on the proper pin to hole ratio for waved pins. Theo
Electronics Forum | Thu Jul 21 22:14:34 EDT 2005 | Ken
Anyone else disagree with IPC-2222 for min-lead to max hole in the application of ribbon lead connector styles?
Electronics Forum | Wed Jul 20 13:47:42 EDT 2005 | russ
IPC has this. I cannot remember which one, Here is what I do for a quick reference. square pin - add .015" to the pin dimension e.g. .025" square pin gets a .040" hole. OR if the pins are large get the max dimension )e.g. a .025" square pin has
Electronics Forum | Wed Jul 20 17:23:19 EDT 2005 | davef
IPC-2222 - Sectional Design Standard For Printed Board For Organic Printed Boards, Table 9-3 � Plated Through Hole Diameter To Lead Diameter Relationships will give you the standard information you require.
Electronics Forum | Thu Jul 21 13:56:48 EDT 2005 | russ
Thanks Dave, Now I am going to find out if I am consistent with the IPC.
Electronics Forum | Mon Jun 28 11:47:54 EDT 1999 | Christopher Cross
| | | hello, | | | | | | has anyone tried dispensing solder paste in thru holes instead of waving or hand soldering. if so how did it work out for you. | | | thanks for the input | | | | | | wayne | | | | | | | | | | | We have tried this mainly
Electronics Forum | Fri Jun 11 03:50:39 EDT 2004 | Scott B
We currently have an issue with via's in pads which we have been living with for some time. The problem has now escalated with the need to increase the via hole size to achieve PCB fabricators aspect ratio's. We are now not only experiencing solder d
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