Electronics Forum | Tue Apr 13 11:41:18 EDT 2021 | jeremy_leaf
I have a SAC305 preform with which I am attempting to bond a gold coated component to an ENIG coated PCB pad. I've specified 2 microinches of gold for the ENIG. It worked previously but now with a new batch of boards, I am having an issue where the p
Electronics Forum | Wed Apr 09 09:48:49 EDT 2003 | iman
after oven bake dry the PCB, we process within 4-hrs, else need to rebake again under same baking parameter. taking a look, the exact pads with the blowholes are full ENIG pads with no via holes under the solder-intend land areas. In event there is
Electronics Forum | Mon Apr 07 04:33:43 EDT 2003 | Neil
Iman, How long after washing the boards do you process them? Are there any vias or Micro vias on any of the pads you see the blow holes on? A possible cause of a blow hole in a solder fillet or PCB is the escaping of Moisture under extreme temps. Th
Electronics Forum | Fri Apr 09 20:47:36 EDT 2010 | 89jeong
I think the oxidation on the pad happens easily but do not on Au plated pad.The reason may be caused by improper cleaning or Au plating thickness in plating process. But,before suspecting the pcb board, you need to check your process or used material
Electronics Forum | Fri Apr 09 09:08:40 EDT 2010 | cast2010
Hello, I produce two types of board. - 100% Thru Hole - 50% thru hole and 50% SMT For the second, I have a bad wetting after the reflow on the top. The pcb board have Au-Ni pad. I use a water soluble paste. I clean the board with a solution with
Electronics Forum | Thu Aug 24 15:37:50 EDT 2006 | Chunks
Hi Any, This is from an earlies thread "Solder Ball After Reflow Process". Date: August 16, 2006 01:52 PM Author: Russ Subject: Solder Ball After Reflow Process Oven settings are meaningless here. What does the board see? It is the paste we a
Electronics Forum | Sat Sep 26 19:09:17 EDT 1998 | Graham Naisbitt
As an addendum to Daves posting, please consider that: There is no such thing as no residue fluxing. A no-clean must herefore, have benign residues - in other words, they are not as efficient at removing surface oxides to enable good solder joints. S
Electronics Forum | Mon Nov 06 09:38:55 EST 2000 | Dean Stadem
We have seen this problem several times. It always goes back to pad solderability, very seldom does it have anything to do with ball size. If there is no evidence of wetting on that pad, but all of the other pads did solder, you need to ask yourself
Electronics Forum | Fri Apr 29 14:16:16 EDT 2011 | ppcbs
Below is the long explanation. This defect is most commonly found with BGA components, but can arrise with all components. I see it happening more now with lead free boards that are being assembled with a no clean flux. Best short term remedy is t
Electronics Forum | Wed Jan 17 03:35:07 EST 2001 | Arul
We have few failures similar to the discussion in this thread, on a 50 Mil pitch, 30 Mil mill Ball PBGA. Would like to understand the mechanism of the BGA reflow process bit more. Appreciate your response to the following. 1.We sheared few solder ba
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