Electronics Forum | Thu Oct 05 16:48:41 EDT 2000 | LarryK
Has anyone ever used the circuit repair kits? The type where you can replace a PTH or SMT pad that has been lifted or damaged? It appears that you just select a pad, trace or whatever needs replacing from a panel and heat or glue it onto the board.
Electronics Forum | Thu Oct 05 17:05:36 EDT 2000 | JAX
These types of foil kits work just fine as long as they are used before expiration. Scraping off the epoxy coat gets a little tough on fine pitch pads and etches. I have always like to use a solder sample board to retrieve my bits & pieces from whene
Electronics Forum | Fri Jul 13 08:25:03 EDT 2001 | caldon
You will need to prepare the component and site for rework. Using solder wick remove the solder from the pad site and the component balls. You can also use a heated Vacuum desoldering tool. To reball we have been using Winslow Automation reballing ki
Electronics Forum | Tue Jun 21 21:54:34 EDT 2005 | Zeta
PCB BOARD - After removal of the BGA from the PCBA. In the midst of removal of the solder at the PCB, the green mask was scratched. If we do not repair the green mask, the whole board will have to be scrapped. Which repair kit do you recommend. W
Electronics Forum | Thu Jul 22 15:15:24 EDT 2004 | russ
You can purchase pad repair kits at some "radio shack" type stores or you can order them from some such as Circuit repair corp. If you know where the signal traces go from the individual connector pins I woul;d recommend just adding a wire frm the p
Electronics Forum | Mon Jan 19 09:49:20 EST 2004 | davef
Not as such. Choices are: 1 Cut and epoxy some board foil from your board fabricator. 2 Sacrifice part a pad repair kits from the likes of: * Engineering Lab 905-785-1982 * Circuit Technology Center 978-374-5000 * General assembly suppliers catalog
Electronics Forum | Thu Jun 04 12:05:43 EDT 1998 | Anthony
Dear Dave, I have a "possible" solution to your problem, though I have never tried it myself. If you're trying to come up with a non-abrasive technique for removing solder-keep reading. If it's a faster method you desire, do yourself a favor and hi
Electronics Forum | Thu Feb 22 20:53:44 EST 2001 | davef
You're not sposed to pull the mask from the BGA when reworking it!!!! ;-) Well, if you insist. You can be as fancy as you want. Basically, all you need to do form a dam to prevent the solder from flowing from the pad to the via and starving the
Electronics Forum | Tue Oct 26 15:44:35 EDT 2004 | Paul_pmd
Hi Mike, Surface mount components arn't difficult to work with at all. They have pretty much the same tolorance to heat degridation as Dip packages. I suggest two Irons when working with two pole resistors and caps. Heating only one end at a time wil
Electronics Forum | Tue Nov 11 09:19:17 EST 2008 | davef
By the way you asked the question, we assume that by "reballing" you mean bumping, we should be able to figure that out: * Volume of the ball = ( pi*d^�)/6 = [355/113] *0.6*0.6*0.6]/6 = 0.11mm^3 * Volume of solder required = 2*volume of ball = 2*0.11
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