Electronics Forum: pad size (Page 13 of 92)

Re: BGA PAD REDUCTION

Electronics Forum | Sat Jul 31 13:35:14 EDT 1999 | Miguel Mariscal

| Has anyone done the research on BGA pad size? suppose I have a 0.030" diameter pad as recommended pad size from the spec, what will the minimum pad size allowed? We are laying out a high density board. | If you know what component your'e going to u

28 pin QFN Pads.

Electronics Forum | Wed Sep 15 10:59:12 EDT 2010 | asksmt

Thanks for the valueable feedback, I have two questions 1. why do you have to extend the pad size ? is it okay if i keep pad size 2. I am currently using thermal pad size recommended in datasheet max value 4.2mm x 4.2mm, how much should i shrink

How to identify any Vibration Source in Reflow Oven

Electronics Forum | Wed Aug 07 11:21:28 EDT 2019 | charliedci

The melting of the solder during reflow itself can center up or skew a component. This could be pad size differential, incorrect pad size, unequal solder deposition amounts, pad spacing in reference to component size just to name a few.

Stencil Aperture Size vs Copper Pad Size

Electronics Forum | Mon Aug 08 18:59:49 EDT 2016 | oleksz

What should be solder paste stencil aperture proper size in comparison with PCB copper pad for lead free technology? When designing PCB foortprints I was using solder paste pad undersize of 2.5 mils (0.06mm) per side (solder paste pad size was 2.5 m

SMD module moving during reflow

Electronics Forum | Fri Jun 21 02:11:27 EDT 2019 | alanyang

Many aspects cause such problem, stencil windows and thickness, thermal pad and crowded PTH vias on PCB, the castellated pad size and pcb pad size. Do you have picture for reference?

Question on Pad Size for ICT Test Points

Electronics Forum | Tue Aug 07 15:05:27 EDT 2001 | gdstanton

Anyone have an idea on what the smallest feasible/reliable pad size and pitch should be for a PCB designed with an array of ICT test points? Thanks in advance for your help.

Solution to Misaligned Component

Electronics Forum | Mon Jan 09 17:52:50 EST 2023 | duchoang

The reasons could be: -The pads size are uneven. Modify the pads size. -The part has not enough time for self-centering. Check and increase TAL. -Solderpaste not melted completely. Increase peak temp. -Solderpaste does not work well. Use alternate so

Re: BGA PAD REDUCTION

Electronics Forum | Mon Aug 02 18:46:33 EDT 1999 | Jim Blankenhorn

| | Has anyone done the research on BGA pad size? suppose I have a 0.030" diameter pad as recommended pad size from the spec, what will the minimum pad size allowed? We are laying out a high density board. | | If you know what component your'e going

soldering issues with MELFs

Electronics Forum | Thu Jun 26 09:42:16 EDT 2008 | gabriella

Hello Mark, I would recommend to look again on the pads. in many cases board design is causing these issues. Check 1. Is pad size good for the part 2. Are both pads the same size 3. traces connected to the pads should be same size 4. vias connecte

Film Capacitors - Tombstoning or Drawbridging Problems

Electronics Forum | Wed Mar 25 14:46:16 EST 1998 | David Spilker

We are having some problems with "drawbridging" on 0805 film capacitors. We have already reduced the pad width from .050" to .040" based on input from vendor. Defects appear to be random as far as location on the PWB and direction of placement. We


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