Electronics Forum | Thu May 13 18:36:55 EDT 1999 | Andrew Wulff
| | On 1.27mm (0.050 inches) Standard Ball Grid Array's. | | The ball size diameter starts at approximately 0.025 inches. | | | | If the ball size decreases to 0.012 inches (due to the solder flowing down a via) is the solder connection reliable? |
Electronics Forum | Fri Jun 30 10:42:24 EDT 2000 | Chrys Shea
That pad had a 16 mil dia, so I arrived at 20 mil squares by adding 2 mils to each side of the pad. Following that logic, a 12 mil pad would use a 16 mil square. But a 12 mil pad is on a finer pitch that isn't mentioned, so you should definitely
Electronics Forum | Thu Jun 29 09:46:41 EDT 2000 | sree
Hi Jax, The microbga discussed earlier in the forum is mounted on 16 mils pad whereas mine is on 12 mils pad. Can I use the same aperture opening ?Please advise.
Electronics Forum | Tue Nov 08 05:00:23 EST 2005 | rlackey
Hi CW, Regarding orientation, yes, your diagram is right - see the following link for confirmation. http://search.murata.co.jp/Ceramy/image/img/A18X/C2EB3C.PDF Regarding information on bending strength you want to talk to your local Murata office
Electronics Forum | Mon Jun 07 21:31:46 EDT 2004 | davef
That's thin board. The test that you ran is the best method for determining the specific answer. Bob Willis says, "Use pad mating to lead wetting area. Some have found the ratio to be as much as 44 grams/sq in." Bob Willis and Phil Zarrow have po
Electronics Forum | Tue Jun 06 11:57:12 EDT 2006 | Chunks
IPC 610 says acceptable Class 1 (Class 2, 3 indicator) if they are entrapped/encpsulated balls within 0.13mm of lands or pads. or exceed 0.13mm in diameter. Defect Class 1,2,3: Solder ball violates min electrical clearance. Solder balls not entrap
Electronics Forum | Thu Jun 29 09:29:46 EDT 2000 | JAX
sree, You might want to check the archives. If not, I found this just a few questions below yours!! [Back to thread listing at top] Posted by Igmar on June 22, 2000 at 10:27:26 AM EST Can someone please help with the aperture size on a Micro BGA st
Electronics Forum | Wed Dec 04 18:59:34 EST 2002 | Steve Godber
Is there a Technical graph/chart/table guideline for designers on which Solder Sphere/pad size is plotted vs. pitch design to acheive maximum SJR?
Electronics Forum | Wed Feb 27 19:55:13 EST 2002 | nifhail
Hi, I need help to understand further on the via in pad for 0402 requirement. If I were to do the DFM over the brd design which consist of 0402 with via on pad, what is the criteria that I should look for ? I learned that the via in pad does not wor
Electronics Forum | Fri Jan 06 05:03:11 EST 2012 | richieoreilly
Hi All, Just wondering if anyone is placing 0201 components in volume. If so What pad layout are you using, i.e. pad size, shape and spacing. Also are you pads and fiducials solder mask defined or copper defined. Can you also let me know the rough q
