Electronics Forum | Thu Oct 26 05:26:53 EDT 2000 | Mika Pirttimaa
Well, Yes those measurements are required as long as your process is not in control. It is true that quality people easily demand too much and are too strickt in the areas that are not so important. Height of the pad is one of them, it is not very in
Electronics Forum | Thu Aug 18 12:10:40 EDT 2011 | rdubya
Do you happen to know of any good labs for this analysis?
Electronics Forum | Wed Jul 01 04:54:28 EDT 2015 | jvercamm
hi, the last post on pad cratering dates from 2012. We have (likely similar) problems with a RoHS 783 solder ball BGA size 29x29mm^2 (organic package BT), pitch is 1mm and solder ball diam is 0.5mm the field failure is after 12 months, almost exclu
Electronics Forum | Thu Aug 18 14:13:36 EDT 2011 | davef
Here are a few labs that would be good starting points: * Robisan Laboratory; 6502 East 21 St, Indianapolis, IN 46219; 317-353-6249 F357-1270 Susan Mansilla, Technical Director robisan1@aol.com * Trace Laboratories - East; 5 North Park Dr, Hunt Vall
Electronics Forum | Wed Aug 22 13:18:50 EDT 2012 | rway
I also forgot to mention that the pizza-slicers you are using can get out of spec and may need periodic calibration. By cutting too close, these can over-stress your pcbs as well. Do you only see this problem at one cutter or does it matter? Also,
Electronics Forum | Wed Mar 19 09:59:45 EST 2003 | davef
Jodi What's your thinking on the black pad rework technique proposed in: �A Failure Analysis And Rework Method �� Z. Mei, et al, SMTA International 1999, p407
Electronics Forum | Thu Mar 27 14:09:41 EST 2003 | Enrique Chairez
Hi All, I have observed this problem with one PCB supplier, the portion of the PCB area affected was cut and observed in SEM (Scanning Electron Microscope) and submitted to an EDX (Energy Disperse X ray analysis), finding Phosphorus levels higher
Electronics Forum | Thu Mar 27 14:49:20 EST 2003 | MA/NY DDave
Hi Enrique, I don't remember all the energy levels that make the techniques you or your associates are using, effective. Each energy level yields information that must be understood is the best that I should give. HEY Based on my comment, does this
Electronics Forum | Thu Apr 22 07:51:32 EDT 1999 | Vic Lau
after soldering transistors on a flex circuit (Ni/Au plated), one of the lead lift-up from the pad. under microscope (1,000 X), i find some cracks on the the pad surface. with edx analysis, the surface is mainly nickel. have you ever encounter suc
Electronics Forum | Fri Aug 22 09:49:31 EDT 2003 | davef
Ask your supplier for a corrective active and failure analysis of the boards. In parallel, send the boards to a failure analysis laboratory to determine the material on your gold pads. Take your work to another supplier.
