Electronics Forum | Fri Sep 07 12:19:20 EDT 2007 | guqing
We are having problem to develop lead-free (SAC305) reflow profile for big SMT electrolytic caps. The delta T of the joint of the cap with the rest of the board is too big to fit in the tighter lead-free window. Any suggestions regarding the total pr
Electronics Forum | Fri Jun 20 14:08:14 EDT 2008 | wavemasterlarry
LISTEN this is quite a soar subject to me.i have old wounds too from these capacitators and argued with the darn engineers at my old place of employment that if they only stuck to wave and through � hoel stuff, they wouldn�t be in this pickle. IF the
Electronics Forum | Wed Nov 21 19:45:36 EST 2001 | Yngwie
Hi Guys, I need help. I�ve a trouble with non-wetting problem on the lead of 208 pin, 20 mils pitch QFP. We are on intrusive reflow. I never faced this problem before on this product after running them for about 2 years now. This occurred on one pa
Electronics Forum | Fri Apr 17 21:46:18 EDT 1998 | Matthias Mansfeld
I plan to design a multichip module which contains 1 chip with about 200 pads and 2 chips with about 50 pads, no other components.The whole module shall replace as intermediate solution a single chip CPU in QFP208. Thus, the MCM itself must have t
Electronics Forum | Tue Jan 16 20:34:17 EST 2007 | davef
DAVE�S BOOKSHELF ASSEMBLER�S ESSENTIALS Title: Soldering in ElectronicsAuthor: RJ Klein WassinkPublisher: Electrochemical PublicationsISBN: 090115024XPublication date: December 1989 I know, I know. The book was written in 1989!!!! I use this b
Electronics Forum | Thu Dec 21 21:37:19 EST 2006 | Jack
Hi Pavel, Real Chunks, Thanks for your valuable inputs..Selecting the correct location for board profiling is critical in determining the solder joint quality. Am I right to say TC wire attachment locations priority should be as below: (1) Thermal
Electronics Forum | Mon Sep 17 15:27:51 EDT 2001 | jschake
Challenges: The basic defects that impact assembly yield are bridging, satellite solder balls, and opens (i.e. tombstones / draw bridges). There are many variables with the stencil printing process that can impact these; several of them are listed
Electronics Forum | Wed Mar 15 08:47:50 EDT 2017 | emeto
From what I know, you should follow IPC standard for the class assembly that you are building. From your post somebody mentioned something somewhere - doesn't make it official information. I would not be worried about having voids, but what is their
Electronics Forum | Mon May 11 17:35:01 EDT 1998 | Steve Gregory
On 11 May, 1998 Todd wrote: | We are having continuous bridging problems with the trailing | leads on a 26-pin D-sub through-hole connector. The pitch is | 0.100". The connector is going through the wave at approximately | a 20 Degree angle. Does
Electronics Forum | Wed May 09 10:40:10 EDT 2001 | davef
First, your primary side component pads should be designed according to SM-782A, "Surface Mount design & Land Pattern Standard". Next if you did that and your secondary side component pads are the same size as your primary side components, your diff
