Electronics Forum: palladium dissolution (Page 1 of 1)

Gold and Palladium Plating

Electronics Forum | Fri May 17 10:53:15 EDT 2013 | davef

ENEPIG or Imm Pd? Concerns about palladium as a solderability protection are: * Palladium is more difficult to process in fab than gold * Palladium solder alloys can be brittle, similar to gold, without proper soldering process and/or specification/

Dewetting on QFP

Electronics Forum | Tue Jun 07 16:19:58 EDT 2005 | davef

Q1) How to identify on good or bad ICs lead that could contribute to dewetting? A1) Distinguish between good or bad IC that could contribute to dewetting by testing for solderability, according to J-STD-002. Q2) What actions that must be taken in fa

soldering issues

Electronics Forum | Thu May 09 17:16:16 EDT 2002 | davef

Russ makes a good point. While your profile probably meets your paste supplier recommendations, it may not be proper for the component. * Paste suppliers offer general recommendations for tin / lead interconnects. You need to modify that for board

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