Electronics Forum | Fri Nov 08 14:19:59 EST 2019 | dwl
You can try putting titanium stiffeners on the PCB to prevent it from warping. How thick is your stencil? More paste would give you a wider window however too much and you risk bridging. You could try over printing the pad at the heel and toe to get
Electronics Forum | Thu Nov 07 21:28:31 EST 2019 | sssamw
The connector is so long, and has big metal parts, it will be little deformed during reflow I guess, andthe pins planarity should be critical for 200 pins. Did you measure the non wetting pins profile to see if temperature ok? And maybe you can try u
Electronics Forum | Sat Feb 12 09:08:47 EST 2000 | Sal
Experiencing a problem with a 208 PBGA device. I am achieving good wetting with the exception of one ( damn) pin on the outer corner.I have a really good profile but the worrying thing is that it is so inconsistant. Once this open pin failure is dete
Electronics Forum | Sun Feb 13 01:35:55 EST 2000 | Dean
Without further information my first guess would be lack of flux to "cut through" the ENTEK layer. Question: In X-ray is the suspect ball of equal diameter when compared to adjacent balls? If no then the volume of solder is different which would po
Electronics Forum | Sun Mar 28 18:49:36 EDT 2021 | mekmat544
Hello, I would like to ask you if there is some formula how to calculate PTH hole and annual ring for pin in paste technology? Thank you. Mekmat.
Electronics Forum | Thu Jun 10 19:10:05 EDT 2021 | kojotssss
Hi, Get your account. https://software.indium.com/stencil-coach/pin-in-paste-apertures.php
Electronics Forum | Fri Oct 09 00:57:05 EDT 2009 | jjmag921612000
SteveO, I had personal experience with this using a Panasonic MPAV2B. It took a while, but I believe the end result was to have some additional "Z" travel to press the QFN into the paste. Also, the design of the paste on the ground was key to keep t
Electronics Forum | Wed Mar 14 12:06:15 EDT 2007 | Oswaldo Rey
There is an approximate 1W dissipation and has a 2 sq in area below part on solder side as a heat sink, vias are to physically conect this solder side area to power pad, so its necessary to use an adequate amount of paste. I really don�t think it has
Electronics Forum | Thu Oct 15 11:04:28 EDT 2009 | spitkis2
Thanks Jim. Pressing the QFN into paste was what I thought of, just wasn't sure if it would cause solder paste to be pressed outside the pad area and possibly bridge with an adjacent pad. Do you recall the ratio of paste coverage to the pad area?
Electronics Forum | Wed Sep 30 13:10:49 EDT 2009 | spitkis2
Hi guys, Can someone please clarify whether adjustment of Z axis travel is a critical parameter during placement of QFN devices. If so, to within what tolerance? In other words, should a pick and place machine position a QFN down on the board so t
