Electronics Forum | Wed Mar 07 07:21:08 EST 2007 | jdengler
We window pane the heat sink pad to reduce the amount of paste for DPACK component
Electronics Forum | Fri Mar 09 14:31:56 EST 2007 | stepheniii
That also allows a channel for degassing and also breaks up paste into sections that tend to balance the forces acting on the part. So basically window paning is even better than you might think.
Electronics Forum | Thu Aug 23 15:44:17 EDT 2012 | bandjwet
Anyone have ideas on how to tin window=paned areas of a 4 x 40 gauge ribbon cable? The areas are 2-8 mm in length. Thanks! Bob
Electronics Forum | Wed Apr 18 14:17:48 EDT 2018 | esoderberg
Further divide the ground block into more than 4 panes. Also think about using, assuming you have good placement of using Loctite chip bonder on two opposing corners. Lots of ways to get good results
Electronics Forum | Mon Dec 06 14:44:41 EST 2021 | dwl
1 to 1 stencil aperture to pad should be fine on the gull leads, and yield 100% coverage with leaded solder. The thermal pad is going to be a challenge though, if you truly need 100% coverage. There will be out gassing from the flux and this will nee
Electronics Forum | Wed Oct 21 10:18:00 EDT 2009 | stepheniii
Make sure the ground pad is reduced on the stencil and window paned. The solder on the thermal pad can lift the part up, especially if it traps gas. 360-380C does sound insane. I would believe a manufacturer saying 360-380F before I could believe
Electronics Forum | Wed Jun 06 10:28:39 EDT 2012 | kahrpr
You need to get your local rep to demo the grid loc. That is what it is for double sided boards. when the table comes up the pins adjust to the different height components. I also thought I saw a similar product on one of the advertising Panes on thi
Electronics Forum | Wed Jul 18 17:09:45 EDT 2018 | slthomas
Update - next run started out horribly so went to another stencil design. Reduced thermal pad coverage by about 40% with 4 panes, with cutouts to avoid the vias. Worked like a charm for 10 boards (90 parts). I think we're finally on to something.
Electronics Forum | Fri Jun 03 15:18:04 EDT 2005 | mmjm_1099
Hello, I was wondering about specs on SMT stencil ordering. I am looking to make some sort of template for aperature layout of some parts. I was wondering some issues that you have all came across or made to change to better suit your boards. For ins
Electronics Forum | Thu Mar 08 04:39:05 EST 2007 | stimpk
Hello, For the most part the ground side width should be reduced, but more than likly you are well into a run of built pcbs? Profiles may or not help in cases of the dreaded DPACK. No issues on any other areas or components so I'd stay away from t
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