Electronics Forum | Tue Nov 28 09:21:58 EST 2006 | Michael Sanders
Is anyone aware of any articles, white papers, etc., that discuss the gap between the lead and the pad after a SM joint is soldered? In particular, I am looking for a formula for that "gap" for various components.
Electronics Forum | Fri Nov 04 16:08:14 EST 2005 | BK
There are various China made oven which can do the job. Price for Reflow oven is about USD35K and Wave soldering is about USD55K. If you need more info, please contact us. BK Email : sales@hynergy.com.sg
Electronics Forum | Fri Sep 03 03:56:41 EDT 1999 | Wolfgang Busko
| We've noticed that there are many different recommendations for pad sizes for various SMT parts. This seems to vary wildly from manufacturer to manufacturer for the same case sizes. Is there any standards that can used used to specify these sizes
Electronics Forum | Sun Sep 05 03:52:11 EDT 1999 | Brian
| We've noticed that there are many different recommendations for pad sizes for various SMT parts. This seems to vary wildly from manufacturer to manufacturer for the same case sizes. Is there any standards that can used used to specify these sizes
Electronics Forum | Wed Nov 29 10:10:50 EST 2006 | M. Sanders
I'm sorry, Dave - I didn't make myself very clear. Yes, this space (not really a "gap") is filled with solid solder. For instance, if you place a gull-wing component in solder paste, after reflow, there will probably be a thin film of solidied solder
Electronics Forum | Thu Oct 11 14:56:27 EDT 2007 | chef
Thank you- my point exactly and it starts in SMT- operators pulling the wrong paste from the fridge, touch up using the wrong solder wire, etc. My solution- GET THE LEAD OUT!!!!! I'm a CM- high mix, low to medium volumes. No steady all day every day
Electronics Forum | Tue Sep 30 20:55:14 EDT 2008 | davef
Residues from different no-clean fluxes produce different levels of variation in RF circuits. Some no-clean fluxes work fine. Following this, a no-clean flux can produce different levels of variation in RF circuits depending on the process setup.
Electronics Forum | Fri Sep 03 14:37:45 EDT 1999 | JohnW
| | We've noticed that there are many different recommendations for pad sizes for various SMT parts. This seems to vary wildly from manufacturer to manufacturer for the same case sizes. Is there any standards that can used used to specify these siz
Electronics Forum | Mon Sep 06 19:59:59 EDT 1999 | armin
| | | We've noticed that there are many different recommendations for pad sizes for various SMT parts. This seems to vary wildly from manufacturer to manufacturer for the same case sizes. Is there any standards that can used used to specify these s
Electronics Forum | Tue Sep 07 09:11:33 EDT 1999 | Dave F
| We've noticed that there are many different recommendations for pad sizes for various SMT parts. This seems to vary wildly from manufacturer to manufacturer for the same case sizes. Is there any standards that can used used to specify these sizes
