Electronics Forum | Wed Mar 27 10:32:29 EST 2002 | barryg
hello evryone. I am rleatively new to smt production. Though we have been successfully running pcb assy's and getting very good solder quality we are trying to get some proccess control parameters set up for our printing process. We have a semiauto s
Electronics Forum | Wed Mar 27 12:37:12 EST 2002 | jax
Barry, If you are looking to set up a documented process with set parameters you might think about performing a DOE based on the parameters you can control or change. With any measurement device you should be able to log the info gathered so you ca
Electronics Forum | Wed Dec 17 13:25:38 EST 2008 | evtimov
I am printing on DEKs and using simulara paramateres as for a solder it works really fine. In general going faster gives you more paste/glue. Less pressure gives you more paste/glue again. All the rest depends on your current board. Regards, Emil
Electronics Forum | Wed Dec 17 11:25:38 EST 2008 | davef
dots of minimal height. So, use a lower viscosity adhesive. * Higher standoff components => larger (and taller) dots. So, use a high viscosity [typically, also high yield point] adhesive.
Electronics Forum | Wed Dec 17 13:34:15 EST 2008 | jorge_quijano
Ok, thanks for the info, fortunatelly we already have our Camalot glue dispenser machine In-line with our MPM, for helping whit the high stand-off components.
Electronics Forum | Wed Dec 17 09:55:10 EST 2008 | jorge_quijano
Hi to everyone, I will be runnig product with adhesive with a MPM UP2K, I'll use a 0.020" stepped stencil & metal blades. Is it better to use high speed for print head travel? more/less squeegee force than with solder? slow snap off? what could you r
Electronics Forum | Wed Mar 27 16:54:47 EST 2002 | davef
STARTING RANGES * Pressure � 1 pound/inch of blade (metal); 1.6-3 pound/inch (plastic) * Speed - 0.5 to 3 inch per sec [for standard pitch]; 0.5 to 1 inch per sec [for fine pitch] Your paste supplier�s recommendation is a good place to start. * Sepa
Electronics Forum | Thu Aug 12 05:06:12 EDT 1999 | FMung
Hello, Can any netters suggest what critical parameters should be considered & what are there assoicated impacts for a solder paste printing process ... B.Regards, Felix
Electronics Forum | Fri Sep 22 12:11:31 EDT 2023 | wippsen
Hi there, if there is insufficient Volume you may optimize the design of your stencil. Its not the goal to decrease the tolerances. Take the PCB and take a look at the printing Shapes with microscope or use the zoom in 3D Function. If there is too l
Electronics Forum | Thu Aug 12 17:07:09 EDT 1999 | Brian Wycoff
| Hello, | | Can any netters suggest what critical parameters should be considered & what are there assoicated impacts for a solder paste printing process ... | | B.Regards, | Felix | I have a process cause and effect diagram for the entire print
winsouce.jpg)
