Electronics Forum: part (Page 875 of 1118)

Re: Solder Iron/Tip Problem!

Electronics Forum | Thu Jun 17 16:18:22 EDT 1999 | Earl Moon

| | Has anyone had problems with the Weller MT 1500 IRON/TIP solder station? | | Please advise your problem and resolution. | | | | ddj | | 6/16/99 | | | I don't like to use the needle tips (MT2 series), but the rest of the tips work fine. The MT2

Re: Cracked Capacitors

Electronics Forum | Mon Jun 14 08:48:29 EDT 1999 | Adam Pratt

| | | Our company is experiencing cracked caps at our pick and place operations. The caps are being placed onto epoxy dots for subsequent wave solder operations. At present, be have set the pressure of the head at 2 in/lbs. This being down from man

Re: Cracked Capacitors

Electronics Forum | Mon Jun 14 11:39:29 EDT 1999 | Marshall

| | | | Our company is experiencing cracked caps at our pick and place operations. The caps are being placed onto epoxy dots for subsequent wave solder operations. At present, be have set the pressure of the head at 2 in/lbs. This being down from m

Re: quoting smt

Electronics Forum | Tue Jun 08 23:17:47 EDT 1999 | Scott Cook

| I am interested in seeing how some of you quote smt work. Currently we quote off a bom without component packages known then look in data books to find out what type of component they are. This job will be mine soon but i really believe there is a

Re: pitch

Electronics Forum | Sat Jun 05 07:37:25 EDT 1999 | Dave F

| We are changing from through-hole to SMT, wondering what pitch requirements would an 8 pin SOAC require for pick and place? We think that this would be our finest pitch part. | John: Never heard of an "SOAC." SO packages are 50 ptch (50 mil, 1

Process Change

Electronics Forum | Thu Jun 03 09:40:20 EDT 1999 | Ryan Jennens

In a month or so, we will be getting an in-line x-ray inspection machine. It will require that we solder our most comlicated side (normally top) first. This is opposite to our process now where we solder our passive (bottom) side first. We cannot

Re: electroformed stencils

Electronics Forum | Thu Jun 03 18:00:33 EDT 1999 | John Thorup

.020" pitch spacing. Which have yielded my process excelent results. | | My main stencil supplier is I-Source in Irvine, CA and has pretty much standardized on 100% lazer cut stencils for competetive pricing. | | Hope this helps. | | | | Deon Nunga

Re: Ball Deformation Inspection for CSP devices

Electronics Forum | Thu Jun 03 15:15:09 EDT 1999 | J.S.

| I am currently sourcing equipment to mount CSP devices. I have looked at the GSM Flexjet & also the Siemens 80 F series. However these machines only look for ball presence not ball deformation. Panasonic are the only ones who have a 3-D camera capa

Re: SOT23 crack during solder reflow

Electronics Forum | Wed May 26 18:04:16 EDT 1999 | John Thorup

| After reflow proces in convection-IR oven we find broken body of SOT23 elements. There is no problems on other elements (SOIC, chip R,chip C, etc) | Where is the problem? | | Thanks in advance! | Check your profile at the site of cracked component

Re: The care and feeding of adhesive nozzles

Electronics Forum | Mon May 24 13:06:12 EDT 1999 | Deon Nungaray

| | | Any suggestions on how to maintain Adhesive dispensing nozzles??? They seem to plug up over night and it is starting to get on my nerves. We have tried leaving the nozzles in the machine, removing them and soaking in alcohol, blowing them o


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