Electronics Forum | Thu Dec 11 13:49:48 EST 2014 | emeto
If you have a chance ask them to bring in one of your products(take board, stencil and some heavy part on the PCB that will absorb a lot of heat). They should be able to screen(even manually) it for you, hand place the part and send it through the ov
Electronics Forum | Wed Dec 10 13:26:03 EST 2014 | spoiltforchoice
I don't have one, but a lot of ovens of this vintage are on the market because they DO NOT cope well with lead free processes. There is one of these on eBay right now and it even says ROHS is right at the limit of what it can just about manage so thi
Electronics Forum | Tue Apr 12 21:43:50 EDT 2016 | cmarasigan
There is an auto teach of QFP component for CM402 wherein machine can auto recognize number of pins, pin pitch. Just make sure on your part data you have selected the right reference part (Ref: 171)for QFP. For manual component recog; 1. Set Comp si
Electronics Forum | Fri Aug 07 20:07:16 EDT 2020 | emeto
Based on datasheet you can have balls with significant variation(twice volume) 0.13Sqr/0.19sqr = 0.46 I would suggest you tighten the machine recognition control. You will recognize BGA balls that are very different in size and reject the part. This
Electronics Forum | Mon Jul 20 12:58:51 EDT 1998 | Dew Lolly
QFP's are best left the professionals. There are MANY subtle issues with fine pitch lead forming such as critical tool design issues ability to check critical dimensions etc. Unless you want to replow this grown in hopes of getting a promotion or c
Electronics Forum | Thu May 10 13:58:26 EDT 2001 | tomgervascio
It sounds like 3D imaging is much better at fault detection for partially visible leads like SOJ packages. Can any of the 2D systems actually do a solderjoint inspection on the outer rows of BGAs or is the angle too acute to accurately look at these.
Electronics Forum | Mon Jul 20 15:11:34 EDT 1998 | Scott McKee
| QFP's are best left the professionals. There are MANY subtle issues with fine pitch lead forming such as critical tool design issues ability to check critical dimensions etc. Unless you want to replow this grown in hopes of getting a promotion or
Electronics Forum | Thu May 11 12:44:04 EDT 2006 | slthomas
One of our customers' products has a couple of adjacent 0603 packages (one resistor, one cap) that are .010" apart. They are side by side, not end to end. The adjacent pads between the two parts are electrically connected so bridging isn't an issu
Electronics Forum | Mon May 07 09:46:15 EDT 2001 | orbotech
3D imaging refers to the acquisition of images from multiple perspectives using, preferably, multiple sources of illumination, while 2D imaging refers to the acquisition of an image from one perspective. An AOI system with 3D imaging is able to acq
Electronics Forum | Wed Jul 09 16:05:12 EDT 2008 | bkreiman
We are using a right-angle SMT power connector on a board. The connector has 4 leads and two board alignment pins. The layout for the board is such that 1 of the leads is not used and the pad for the lead is not connected to anything, not even grou
