Electronics Forum | Mon Nov 29 10:13:02 EST 2010 | vetteboy86
My research starts here. I'm just beginning to research the effects of using a leaded part in a no lead process. Before I began, I know there are temperature differences. The part in question has a 260 C spec. Next I would like to find out if any c
Electronics Forum | Tue Apr 06 09:50:58 EDT 1999 | Justin Medernach
| Does anybody put QFP's on the backsides of boards? Can they be reflowed without falling off? Do you use adhesive? | I use a double sided reflow process all day, everyday. I've hung QFP240s with embedded heat sinks and they don't fall off. Yei
Electronics Forum | Fri May 17 20:11:32 EDT 2013 | isd_jwendell
I am familiar with TI's documents on QFN mounting. I do not have an X-Ray machine, so I worry about excessive voiding that could happen with using the thermal vias improperly. As a general rule-of-thumb, I print paste with a 25% reduction on the ther
Electronics Forum | Tue Sep 07 09:03:23 EDT 2010 | davef
We don't use this part, but Samtec reflows it for their published durability tests. They published the reflow profile as part of the test report on the Samtec site.
Electronics Forum | Fri Apr 12 16:30:21 EDT 2002 | stepheno
If you are going to wavesolder the board after SMT you will have to epoxy the parts on instead of paste/reflow. I used to work for a company that squeeged it on. You will have to research component layout guidelines if you do want to wavesolder. If
Electronics Forum | Mon Jun 06 09:05:02 EDT 2005 | cmiller
How do apply it in your process? It would seem best to screen the electrically conductive epoxy then dispense the thermally conductive epoxy to bond the part to the heat sink pad. Any help or opinions would be appreciated. I dont think the System Uni
Electronics Forum | Mon Jun 06 10:02:39 EDT 2005 | cmiller
How do apply it in your process? It would seem best to screen the electrically conductive epoxy then dispense the thermally conductive epoxy to bond the part to the heat sink pad. Any help or opinions would be appreciated. I dont think the System Uni
Electronics Forum | Fri Oct 22 19:52:47 EDT 1999 | Garth Monlux
I need to know the recommended pad layout for a 44r package. The part is an atmel flash AT49F004. Is there a standard that I can look at?
Electronics Forum | Mon Jan 17 11:29:19 EST 2005 | Brad
We cuurently are using parts from 1808-0603. Ic's up to QFP133. Hopes of going smaller as time goes on. Definetly would like 0201 capabilities. Thanks, Brad
Electronics Forum | Mon Sep 06 09:03:45 EDT 2010 | aj
Hi all, Looking for some advice on how to run this component through the SMT process or is it always hand soldered? Part number is HSEC8-120-01-S-D-EM2 We are currently handsoldering. aj...
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