Electronics Forum | Thu Jun 26 14:25:19 EDT 2008 | jax
Current Acceptable HMP Soldering Methods: 1. Wave / Selective Solder: Some Brands require upgrades to heating elements and Pot materials 2. Laser: Works well with PTH and medium/large passive SMT. Damage to PCB masking can occur when try
Electronics Forum | Fri Apr 08 16:26:36 EDT 2005 | Grant
Hi, It seems weird that an automated pick and place machine at a board shop would not be up to NASA standards, but placing the components by hand would be. However most SMT will self center a bit, so if your close enough, you should be ok. You rea
Electronics Forum | Wed Oct 15 15:52:36 EDT 2014 | davef
VTEK says …” Carrier tapes are made from three primary materials. (All are manufactured in accordance with EIA standards) 1 Polycarbonate is a black plastic material with excellent impact strength. It is used primarily for bare die and small form fac
Electronics Forum | Tue Mar 09 13:11:00 EST 1999 | Nancy
Maybe it is all what you get use to. Our assemblers like the vacuum pen. Since we do more than passive components, some parts would be difficult to hold and line up. As for as our Fristch, we use it as a manual and just have our bins on the side.
Electronics Forum | Tue Jan 05 19:25:50 EST 1999 | Earl Moon
| Jan 05, 1999 | | My question is: | Pls kindly advise what is the meant by a "Think Film hybrid design" and what are the advantages it would have on surface mount passive components e.g. capacitors and reisitors?? | | Thanks for your respond. | El
Electronics Forum | Tue Dec 13 12:50:30 EST 2005 | grantp
Hi, We used to use large reels of 0603 passives, but now we have moved to 0402 our supplier only has standard small reels. That's actually less components and we have to change the machine more often. Anyone know any supplier that has the very larg
Electronics Forum | Tue Aug 25 08:51:16 EDT 1998 | Justin Medernach
| | | Hi, | | | Does anyone has experiences in reflowing Ceramic BGA and found solder wicking ? Solder wicking has the syndrome that solder being wick from the pad and ended up in the leads. | | | We have rule out the possibility of not printing any
Electronics Forum | Tue Jun 16 09:15:56 EDT 1998 | Justin Medernach
| We are very concerned about microcracking in SMT P&P process. I want to know something about: | What is microcracking? | When did it occur? What are the causes? | How can avuid this phenomena? Toni, Micro cracks can be caused by a ton of conditions
Electronics Forum | Thu Sep 19 15:06:39 EDT 2013 | jvadillo
We have already one desktop oven and a manual stencil printer. And we have a quite complete soldering bench with several JBC tools. We also have stock for all active elements we use. We normally relay on the PCB assembler to provide the passive comp
Electronics Forum | Fri Feb 13 11:22:17 EST 2015 | slarochellesmt
I can offer some background on the IINEO II as I feel it is much better than the Yamaha. I currently have 3 IINEO IIs in production that replaced 3 Assembleon lines. The IINEOs handle quick changeovers better than any SMT line that I have used to d