Electronics Forum | Fri Sep 24 07:31:13 EDT 2021 | mun4o
Hi all, our company planning to buy a new /third/ smd line.I have choose P&P ,and solder paste printer , but I hesitate about reflow oven.Now we have two smd lines.The first oven is a old ersa hotfow5 - very robust machine. The second reflow oven is
Electronics Forum | Wed Mar 02 06:19:03 EST 2005 | pjc
Go to http://www.ipc.org and look up IPC-7351 - Generic Requirements for Surface Mount Land Pattern and Design Standard The successor to the IPC-SM-782A is here! The document covers land pattern design for all types of passive and active components
Electronics Forum | Thu Mar 10 09:13:15 EST 2005 | davef
From http://www.IPC.org ... IPC-7351 - Generic Requirements for Surface Mount Land Pattern and Design Standard The successor to the IPC-SM-782A is here! The document covers land pattern design for all types of passive and active components, includ
Electronics Forum | Tue Jun 23 08:39:22 EDT 1998 | Jon Medernach
What is the level of interest in bulk feeding cpassive devices, caps & resistors, 0402,0603,0805? The component mfgs. tell me in 3 years 40% of the passive caps will be bulk fed. Their is currently about a 10% cost savings with bulk over tape & ree
Electronics Forum | Fri Oct 22 07:31:24 EDT 2004 | davef
We're unclear about what you're seeking, but in order to move the conversation along, are you looking for: IPC-SM-782A - Surface Mount Design & Land Pattern Standard ANSI Approved Get up-to-date land pattern recommendations for ball grid array pac
Electronics Forum | Mon Jun 07 17:58:12 EDT 2004 | Rob
UPDATE: Just for fun... I sacrificed a scrapped board to determine what remained and what fell and this is the result. Board dimension was 18"x9" and .9" thick. Components consist of hundreds of passives plus 386 proc (QFP256), TSOPs, SOLs 14/16/20,
Electronics Forum | Thu Jan 13 07:29:49 EST 2005 | Grant
Hi, It's both really, and we are doing higher volume of current products, but new products are increasing in component count, mostly passives. We have analog on our products, and this uses a lot of passives, plus each semiconductor needs decoupling
Electronics Forum | Wed Jul 26 10:39:23 EDT 2017 | dontfeedphils
TL;DR: I like internal part numbering systems for passive chips and the like, and keeping MPNs for active components (or components with many variants and/or options that could be easily confused as equivalents). I've always been a fan of internal
Electronics Forum | Thu Jan 20 17:14:39 EST 2005 | jbrower
Today, I have just finished evaluating Kester's EM907 (SAC305)lead free solder paste and found that for our applications it performs as expected. End result that I am encouraged with the results that we got. The equipment that I used: An SMT2020 to
Electronics Forum | Wed May 19 10:48:40 EDT 1999 | Glenn Robertson
| | | We are currently looking at purchasing some BGA rework equipment. Could someone give us the pro's and cons of IR heating (top/bottom)vs. hot air convection ? | | | All other tips are also welcome. | | | | | | Thanks | | | | | Philip, | | I ha
