Electronics Forum | Tue Aug 25 20:33:31 EDT 1998 | Karlin
| | | | Hi, | | | | Does anyone has experiences in reflowing Ceramic BGA and found solder wicking ? Solder wicking has the syndrome that solder being wick from the pad and ended up in the leads. | | | | We have rule out the possibility of not printin
Electronics Forum | Thu Jun 25 09:37:48 EDT 1998 | Russ Miculich
The real causes of microcracking are not normally due to pick and place - particularly if you are using a piece of equipment with vacuum pick up and release. The real cause of microcracking is due to thermal stresses on the die and the choice of the
Electronics Forum | Mon Aug 27 08:36:52 EDT 2012 | rway
The process is currently being performed by hand. > I am trying to automate the process by switching > to pick and place equipment and using > AOI. > > Problem number one is getting my customer > to sign off on switching from hand assembly to >
Electronics Forum | Fri Jun 12 15:29:51 EDT 2009 | grantp
Hi, We just had delivered one of these and it's incredible. It's an amazing machine, and watching it load such a large board totally accurately, from end to end is amazing. Apparently we took delivery of only the second machine to ship in the world
Electronics Forum | Thu Dec 23 15:29:48 EST 1999 | Glen Robertson
Mike - I'm not in the EMS business, but I suspect most of them are very reluctant to reveal much about their quoting process. You might want to try some of the third-party data suppliers like Ceeris (www.ceeris.com), and you can also check the C
Electronics Forum | Wed Feb 14 12:09:34 EST 2007 | rob_thomas
This was a rather intersting little project to work on due to the fact that I had such a variety of components placed in SMT ( your regular 0402 passives, ,BGA's Qfp's ,TH and SMT connectors ,plus the pesky micro BGA) I ended up with a 5/3 mil electr
Electronics Forum | Thu Jun 29 23:39:25 EDT 2006 | grantp
Hi, Oh, never noticed this old comment, but now the threads been revived i can comment. I have actually owned three MYDATA machines over the duration of the last 6 years, and they all had accuracy problems. It depends on what your doing, but we got
Electronics Forum | Wed Jan 04 12:48:34 EST 2006 | pjc
In-Circuit Test is the best method for ensuring solder joint connections. It is a much more reliable than AOI. An ICT machine can ensure solder connections are made for array package devices such as BGA, PGA, etc... AOI is best for component I.D.- is
Electronics Forum | Thu Apr 15 11:14:34 EDT 2004 | mikecollier
Our conformal coat area has recently requested changes to our bare board houses to perform a pumice scrub operation on the PWB prior to HASL plating and delivery to us. Our first lot received caused us to have void faults under multiple component ty
Electronics Forum | Tue Jan 05 08:35:54 EST 1999 | K Gossman
| If passive componets are cheaper why aren't they more popular? Manufacturers like Murata and AVX claim availability and substantial cost savings but little interest seems to exist. Why? Your input is greatly appreciated. | It is my understanding
