Electronics Forum | Fri Dec 19 12:43:01 EST 2014 | emeto
I had some of these before and they do a decent job. Laser alignment is ok for passive components. Compared to vision systems it has mainly disadvantages. If you have bended lead on IC for example, it wouldn;t catch it and it will place the part. I w
Electronics Forum | Thu Feb 01 05:06:46 EST 2018 | ameenullakhan
Hi Rob, Thanks for your reply. Our customer don't need any pin hole in his board. Attached is the image for your reference. The issue is minimized for us with hot profile ( 80 - 100 sec in between 170 to 180 deg C ) For leaded paste. Lead free pa
Electronics Forum | Fri Feb 09 13:28:24 EST 2018 | jmedernach
Pin holes in the solder joints on various devices can be an indicator of something amiss with the solder paste itself. Solder paste storage may be a concern. Do you possibly have someone putting paste back in the refrigerator after use? Are you tr
Electronics Forum | Tue Feb 13 14:39:52 EST 2018 | horchak
Your profile reflow temps are too low. Omnix338 has a melting temp of 217-221C. Your right on the edge, and your soak temps should be closer to 150 than 180C. Bottom line too high a soak, too low a reflow. Take it or leave it.1874
Electronics Forum | Tue Feb 13 14:52:32 EST 2018 | emeto
I am totally with SweetOldBob on this one. Contamination or voids can also help to boost this defect, but considering that you are probably entirely burning off your flux in the soak zone, you might be getting oxidation on your pads and actually get
Electronics Forum | Thu Feb 15 02:27:51 EST 2018 | ameenullakhan
Thanks for the wishes BOB. I am into process engineering. We don't contact the customer. SMT Line support. Customer might approve also. But our own quality team says its profile issues :(. Will see.what more can be done from our side. Thanks, Ame
Electronics Forum | Mon Aug 22 04:55:06 EDT 2005 | javi
Hi, Need some assitance from people that have experience with qualification for Lead-Free SMT process. We are in a phase to qualify Lead-Free process to one of our new product. The BOM - build of material is complete but we missing some passive com
Electronics Forum | Wed Feb 14 02:06:05 EST 2018 | ameenullakhan
Hi Evitmov, Thanks for your valuable suggestion. we have used RTS profile. And profiles with an average soak and reflow time.:( Those profile didn't help us so much. It at later stage we have adopted to this hot soak profile. There is one partic
Electronics Forum | Tue Dec 07 14:23:34 EST 1999 | JAX
Vahid, What type of error are you talking about? If you mean accuracy I would stick to round fiducials. As far as machines, the only question is about active component placement. For passive components Fuji(CP-series) is the way to go. O
Electronics Forum | Mon Mar 15 10:08:25 EST 1999 | Justin Medernach
| Can sombody help me with this?? When applying solder paste, what factors determine how high off the PCB the stencil is? We use no fine pitch devices. (mostly 603 and 1206 size components) Any help would be greatly appreciated. As you could probably
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