Electronics Forum: passive component (Page 10 of 27)

Mydata Pick & Place Machines

Electronics Forum | Mon Jul 04 22:09:08 EDT 2005 | grantp

Hi, I have one for sale, do you want it! MYDATA machines are perfect for low volume high mix production, and are fairly easy to operate. Don't get a TP model, as they cannot take the HYDRA head, and the MY series are much better. The good thing is

Stock footage of SMT process?

Electronics Forum | Tue Dec 18 17:07:50 EST 2007 | ajd400

Hello there, Please forgive the wildly-off-topic nature of this post. For a video documentary about radios in the 1920's, I'm looking for stock footage of modern PC board manufacture. (I'm a software engineer but doing this effort as a hobby). Th

MY19 Feeder advance problem slot 2

Electronics Forum | Wed Jun 04 00:28:27 EDT 2008 | chrispy1963

There are a couple of things that you can do. First thing to do is take a flashlight and shine it in the card edge connector of slot 2 and see if a passive component or any other part worked its way into that slot. This will cause multiple leads in

Stencil design (maybe old) question...

Electronics Forum | Wed Feb 04 10:01:55 EST 2009 | dcell_1t

Hi there, We're developing a DOE where stencil design (aperture design) is going to be evaluated, currently we have regular reduction on sides, home base (triangular and semi-circle), "C" or "U" shape, and an idea for oval shape for pasives also cam

Pin Hole Issue after Reflow Soldering - Passive Components

Electronics Forum | Thu Dec 28 16:20:12 EST 2017 | rgduval

Pictures of your issues would help us to help you. Pin holes/blow holes are generally caused by either moisture or flux volatiles/organics. Since you've virtually eliminated moisture, it might be time to look at your paste/flux. You can call eithe

Re: BGA rework : IR or convection

Electronics Forum | Thu May 13 12:41:10 EDT 1999 | Eric

| | We are currently looking at purchasing some BGA rework equipment. Could someone give us the pro's and cons of IR heating (top/bottom)vs. hot air convection ? | | All other tips are also welcome. | | | | Thanks | | | Philip, | I have been doing

MYDATA Myspeed software is total junk

Electronics Forum | Thu Jan 13 03:38:18 EST 2005 | Base

Hi Grant, You say your design are increasingly using more passives. Do you mean you're using more and more components per board or is it only the ratio passives/IC's that is shifting? And are you also increasing volume or is it just the component-co

Re: Why so little interest in Bulk Fed passives?

Electronics Forum | Wed Jan 06 23:59:37 EST 1999 | Andy

| | If passive componets are cheaper why aren't they more popular? Manufacturers like Murata and AVX claim availability and substantial cost savings but little interest seems to exist. Why? Your input is greatly appreciated. | | | Because people ju

Land Pattern Discrepencies

Electronics Forum | Sat Mar 25 00:02:17 EST 2006 | rpowell

Hi everyone, I'm relatively new to SMT PCB design and am running into some frustration with the land pattern design of "standard" smt components in particular passive chip components. It seems each manufacturer (Yageo, Rohm, Panasonic) has their own

Stencil design

Electronics Forum | Fri Mar 02 00:21:38 EST 2007 | AMS

Hello, I havea 0.4mm pitch TQFP with heat transfer pad on the bottom side of component. I will appreciate any suggestions with regards to: 1) stencil thickness (Rest of components on board are 0603 passives and few 40 mil pitch IC's) 2) Stencil


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