Electronics Forum | Wed May 29 19:04:39 EDT 2002 | russ
I have heard of using diamond apertures for BGAs to tell you in XRay inspection if you reflowed (diamond means that paste did not reflow) that is the inly thing I coud think of as to why you qould want to do this. Russ
Electronics Forum | Fri Jun 07 15:16:25 EDT 2002 | gdstanton
Ben, Get a copy of IPC 7525 and review it. This will help you understand the relationship of aperture geometry to paste transfer. Good Luck, Greg
Electronics Forum | Wed May 29 22:22:28 EDT 2002 | davef
I don't think thay offer that specific alloy, but if you check with Kester, Alpha, and Indium; they might be able to suggest a supplier or an alternate product thaat is quite similar.
Electronics Forum | Wed May 29 09:33:10 EDT 2002 | Rick Grant
UP-78 FLUX PASTE RECERTIFICATION. We use small amounts of this flux and would like to know what is the best method of recertification when then shelf life has expiried?
Electronics Forum | Tue Jun 04 18:03:25 EDT 2002 | arzu
I recognize this problem as well, building only prototypes with all attention possible, the (small) networks need extra attention for they show opens. Maybe it helps to increase the placementforce a bit to increase the contact area to the paste befor
Electronics Forum | Tue Jun 04 18:21:29 EDT 2002 | arzu
We have "conductive" coats,shoes,floors,chairs and wriststraps. I want to get rid of the wriststraps, for the wires can ruin a product during touchup and hand-building SMD components on paste. My Question: when do we have enough ESD protection?? are
Electronics Forum | Tue Jun 04 22:46:21 EDT 2002 | davef
Factors to consider are: * Squeegee speed * Squeegee pressure * Separation speed * Stencil thickness * Stencil aperture fabrication method * Stencil aperture shape * Paste type * Stencil under-wipe frequency Search the fine SMTnet Archives for a thr
Electronics Forum | Wed Jun 05 14:44:49 EDT 2002 | arzu
Hello again, Indeed most of the mentioned factors we will use as variable parameters, and some of them we keep fixed. I am interested in the way how to measure results. Thanks for the hint to dig into former paste-printing threads; I will look at
Electronics Forum | Thu Jun 13 05:46:34 EDT 2002 | jax
After reflow, Are the end terminals of the melf packages touching or is it a paste bridge? What type of reflow are you using? IR?... Convection?
Electronics Forum | Wed Jun 19 15:22:34 EDT 2002 | pdt203
Does anyone know the name of a smalll handheld device that cleans stencils? One looks like a palm sander and it vibrates the paste out of apertures. Thanks, Johnny Smith
