Electronics Forum | Thu May 10 16:17:59 EDT 2001 | davef
I am unaware of any industry standard for specifying apertures for SM stencils. I am aware of IPC-7525, Stencil Design Guidelines. You can obtain it from IPC [http://www.ipc.org]. Further, it seems like there is an article on stencil design ever
Electronics Forum | Thu May 26 08:52:42 EDT 2011 | davef
Phil Zarrow wrote a useful paper that could help in evaluating paste. Here read it ... Evaluating Solder Paste � Not An Option Contributed by Phil Zarrow of ITM an Independent SMT consulting firm With soldering being the dominant source of assembly
Electronics Forum | Mon Mar 21 12:02:09 EST 2005 | Rob
Hi Colin, Are you using the 1206 package with 4 elements or one of the higher density smaller packages? With the first type you can get them in both Convex or Concave terminations, with most of the solderability problems associated with using the C
Electronics Forum | Mon Jun 07 07:31:59 EDT 1999 | tannlin
| Hi everybody, | | Somebody know the advantages of electroformed stencils on laser cut stencils ? | | any coment is apreciated. | | | thanks | | Al Al I have a quote for you from one of the major CEM's "anyone who thinks they are controllin
Electronics Forum | Tue Jul 13 13:28:18 EDT 1999 | Upinder Singh
| | Hi all , | | | | We are trying to implement the micro-BGA technology at our plant. I need the clarification to the following points: | | | | 1. Is underfill required for micro-BGAs? | | | | 2. What type of stencil apertures are the industry st
Electronics Forum | Sat Mar 18 02:21:31 EST 2006 | pavel_murtishev
Good morning, Once again a met annoying solder beading issue while producing board with PLL (leadless, contacts from the bottom side of the package). Board has very high placement density and beads appear near PLL package only. This package is finep
Electronics Forum | Wed Feb 23 16:49:08 EST 2000 | Dave F
John we paced through the same question recently. Both automatic dispensers and printers can be used to deposit SMT adhesive or solder paste on substrates with a relatively high component density. Dispensers are superior to printers in terms of exa
Electronics Forum | Wed Feb 23 16:49:08 EST 2000 | Dave F
John we paced through the same question recently. Both automatic dispensers and printers can be used to deposit SMT adhesive or solder paste on substrates with a relatively high component density. Dispensers are superior to printers in terms of exa
Electronics Forum | Mon Jul 12 14:30:37 EDT 1999 | Earl Moon
| Hi all , | | We are trying to implement the micro-BGA technology at our plant. I need the clarification to the following points: | | 1. Is underfill required for micro-BGAs? | | 2. What type of stencil apertures are the industry standards for uB
Electronics Forum | Tue Jul 13 13:51:51 EDT 1999 | Earl Moon
| | | Hi all , | | | | | | We are trying to implement the micro-BGA technology at our plant. I need the clarification to the following points: | | | | | | 1. Is underfill required for micro-BGAs? | | | | | | 2. What type of stencil apertures are t
