Electronics Forum | Thu Apr 06 07:53:35 EDT 2000 | jacob lacourse
I have also come across this very same problem and found that our screen vendor made a mistake on our screen. Check the thickness of your screen it should be about six thousandths if it's eight thousandths then you are most likely depositing to much
Electronics Forum | Mon Dec 17 15:41:15 EST 2007 | shrek
Ha-ha-ha-ha-ha,me lad. Wave solder is like an onion, it's got many many layers. Kind of like me-self. I'm a big ogre with many complex layers. At any rate i like the other colleague with his adverstising trigger finger. by golly, me chap, he's a
Electronics Forum | Tue Oct 10 20:14:01 EDT 2000 | Dason C
Hi! CJ. Please advise what is your pitch size ie 15.7 mil or what is your capabiliy can you build the board with pitch 15.75 mil (please note that the actual dimension of the package is 0.4mm), and how many lead on the package. The pad width of Ind
Electronics Forum | Fri Mar 04 01:08:19 EST 2011 | kemasta
Thanks davef Bridging:- There is no heat sink on the BGA, the heat sink will be fix after relow. I do believe paste had something to do with it, but currently this defect didn't appear so oftenly, so we think that the main root cause is not from the
Electronics Forum | Thu Mar 03 14:05:49 EST 2011 | davef
Certainly the bridge is ugly, but the voiding is nothing that you should be bragging about either. Pretty ugly work. BRIDGING: If all of your shorts appear in the vacinity of the heat sink, consider reducing the amount of paste that you apply there.
Electronics Forum | Sun Oct 08 00:18:05 EDT 2000 | Arturo
We are working with a 16mil TSOP Land width=0.2mm(8mil) and use: 1.Type 4 particle size solder paste. 2.Laser cut electropolished stencil: Aperture width=0.19mm (we tried lower than this but had solder insufficiency). Thickness=0.005"(130 microns)
Electronics Forum | Mon Feb 28 07:36:56 EST 2011 | davef
Kim Here's an approach to posting pictures: * On your posting, clickon 'Edit' * Scrolldown past the 'Quote' 'Preview' 'Post' etc line * Clickon 'Attachments' * Enter your picture location * Select the choice that allows viewing the picture * Close ou
Electronics Forum | Thu Sep 02 08:57:29 EDT 1999 | Scott
I am using a 18 mil and below water soluble solder paste (89.5-25-80). I have never used this type of paste. The PCB has a fine pitch component of which I cannot prevent bridging. The paste coverage on the pad looks like it is slumping. It is not a n
Electronics Forum | Wed Sep 08 11:04:41 EDT 1999 | Timothy O'Neill
| I am using a 18 mil and below water soluble solder paste (89.5-25-80). I have never used this type of paste. The PCB has a fine pitch component of which I cannot prevent bridging. The paste coverage on the pad looks like it is slumping. It is not a
Electronics Forum | Fri Jul 15 18:21:55 EDT 2005 | dggjr
We have Kester 256 no-clean spec'd as an alternate paste. I bring some 256 in occasionally to make sure it still works as a backup. The last batch I brought in was bridging like crazy. Scraped it off the stencil, put our regular Alpha back down an
.gif)
