Electronics Forum: paste deposit (Page 10 of 51)

3D Vision vs 2D vision

Electronics Forum | Thu Jul 19 09:56:52 EDT 2001 | Damian Holzmann

The obvious difference between 2D and 3D is that an accurate volumetric measurement can only be obtained with a 3D measuring system. Laser line measurement in 2D does not allow accurate volumetric measurement. If you modify the aperture in a stencil

Tombstoning 0805s w/palladium/platinum/silver terminations

Electronics Forum | Thu Apr 29 22:50:41 EDT 1999 | Kelly Morris

Tombstoning 0805s w/palladium/platinum/silver terminations We are experiencing tombstoning problems on 0805 packages that have paladium/platinum/silver terminations. It comes & goes...... I�ve checked the reflow profile, and paste deposition and a

Solder short-BGA with thermal pad

Electronics Forum | Tue Feb 18 22:15:04 EST 2003 | davef

Arturo, So, you're not shorting to a thermal pad. Given that you're shorting to outer balls, tell us about: * Location of the shorting among the outer balls. * Board construction. * BGA constuction. * Paste deposition. * Temperature measurements ta

DEK's 2D Inspection System

Electronics Forum | Mon Mar 24 23:56:26 EST 2003 | Dreamsniper

Can anyone who has DEK Horizon's 2D Advance Package System explain how does this below feature works? "Automatically triggered recovery sequences" Does it mean that operator need not be there to press any button to clean and recover a print if the

01005 (0402 in metric unit) printing accuracy

Electronics Forum | Mon Jul 18 03:55:39 EDT 2005 | chocw

I am looking for a specification required for printing 01005 size chip. Does anybody know the solder paste deposition accuracy and alignment accuracy required for printing 01005 chip? And currently which machine can print 01005? If somebody knows

Screen Printers

Electronics Forum | Wed Jan 18 01:47:36 EST 2006 | pavel_murtishev

Good morning Manyhats, I have 2 years working experience with automatic DEK screen printers. DEK products are really very good and are able to produce repeatable high quality print. For example I never saw problems with paste deposition for finepitc

RNETs and Lead Free

Electronics Forum | Tue May 06 11:56:56 EDT 2008 | joeherz

We have a board that uses 0402x4 RNET packages that we are having a difficult time getting to solder consistently. Paste deposition is fine (using AIM WS353) and profile is dead-nuts. I'm starting to wonder if this is something that we're just goin

Stencil design (maybe old) question...

Electronics Forum | Thu Feb 05 02:34:05 EST 2009 | sachu_70

Hi Manuel, most passives are chip components. These tend to self-center/align during the reflow process. However, you need to ensure that there is a uniform balanced solder paste deposit. I had tried few such ovals in earlier stencil designs and resu

Solder Paste Inspection Criteria

Electronics Forum | Mon May 06 12:44:50 EDT 2002 | Bob Willis

The SMART Group is starting a new project on PPM Monitoring which will be providing average PPM yield data per month free to the industry. I would like to get feedback or exchange criteria for paste printing as non exists with in IPC or similar organ

Solder balls

Electronics Forum | Wed Nov 13 12:06:53 EST 2019 | slthomas

The answer is usually either too much paste or paste being deposited where it doesn't belong. In some instances the two are related. You don't say what kind of parts you're having problems with and that matters too. I agree with the previous poste


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