Electronics Forum | Tue Jun 16 14:46:25 EDT 2009 | grantp
Hi, If your using NXT to place these BGA's then you must be doing large runs. BGA's are the most easy part to place, and don't worry about them. Just stencil paste down for them as any other component. But we use 1:1 reduction on our stencil, so we
Electronics Forum | Tue Jun 02 21:13:08 EDT 2009 | kircchoffs
thanks for the inputs. we are planning to run on fuji nxt i think cycle time will not be an issue. i still have another question if we can still use the same reflow profile for paste? or do we need to create another profile?
Electronics Forum | Mon Jun 01 21:40:18 EDT 2009 | kircchoffs
i need some inputs regarding this process. is this really eliminates voids and other solderability issues on BGA's?
Electronics Forum | Tue Jun 02 07:31:55 EDT 2009 | scottp
Early on when we started looking at BGAs we tried dipping. We've done it in production for a couple decades with flipchips. Dip fluxing BGAs worked fine in the lab but we ended up starting production with screen printed flux for cycle time reasons.
Electronics Forum | Tue Jun 02 22:19:17 EDT 2009 | mikehe
We have been doing BGA's for years now, and I would suggest updating your profile and place a thermal couple on the BGA, keep in mind the bigger the part the more heat it will need, We stencil print all of BGA's from simple bga's to complex ones, you
Electronics Forum | Thu Jul 21 02:45:51 EDT 2005 | Base
Probably very far-fetched, but I can think of a scenario like this: - machine picks up a component - between vision and placement the part is lost, but the loss is not detected due to oversize tool, which causes the amount of vacuum drop to go unnot
Electronics Forum | Sun Jul 27 19:37:15 EDT 2008 | srt
yup,only happen on PBGA .we alreary follow the solder paste profile.
Electronics Forum | Thu Jul 24 21:20:58 EDT 2008 | srt
Hi, Now we also facing voiding issue after rework .But this only happen to 1 BGA from diffrent PCBA.We also already change 3 type solder paste and fine tune the profile follow solder paste spec but problem intermitten happen again.Pls help to advic
Electronics Forum | Fri May 21 13:24:26 EDT 2021 | rieko
Would anyone know the issue with caked on flux residue coming out of a 10 zone reflow oven? I appreciate anyone's feedback and suggestions, thanks in advance. We are using Indium 10.1 no clean solder paste.
Electronics Forum | Wed Jul 20 02:48:43 EDT 2005 | grantp
Hi, What's really interesting about your photos is there is solder paste on top of the component. If it was blowing the solder off the board you would see solder paste splatter away from the component. But the solder paste is on top of the compon
