Electronics Forum | Fri Jun 25 16:32:45 EDT 1999 | MMurphy
| | | hello, | | | | | | has anyone tried dispensing solder paste in thru holes instead of waving or hand soldering. if so how did it work out for you. | | | thanks for the input | | | | | | wayne | | | | | | | | | | | We have tried this mainly
Electronics Forum | Mon Jun 28 11:47:54 EDT 1999 | Christopher Cross
| | | hello, | | | | | | has anyone tried dispensing solder paste in thru holes instead of waving or hand soldering. if so how did it work out for you. | | | thanks for the input | | | | | | wayne | | | | | | | | | | | We have tried this mainly
Electronics Forum | Mon Mar 27 21:09:29 EST 2006 | ms
Thanks Dave I'm not convinced the air is necessarily in the paste from manufacture - suspicious that it may be folding in during the change in direction of the print cycle - or as the paste travels across apertures. It is not necessarily in the fir
Electronics Forum | Thu May 26 16:41:00 EDT 2011 | scottp
Here's what I do: - Test Surface Insulation Resistance (we're in the high reliability market and use a test significantly harder than IPC's). I also test SIR in combination with other assembly materials like conformal coatings and wave solder flux
Electronics Forum | Thu Sep 04 10:24:39 EDT 2003 | paulrm
The typical PIP process is incorporated into the surface mount process. This approach requires the following: The stencil will be designed so that the correct amount of solder paste can be printed onto the through-holes to form an acceptable joint
Electronics Forum | Tue Jan 25 07:49:17 EST 2005 | davef
On "Solder beading seemed to be a problem", consider revisiting the thermal recipe used for reflow. The PTH barrel may not be getting warm enough. On "Component not being designed to pin in paste work, with no proper standoffs", consider: * Using a
Electronics Forum | Sat Aug 01 01:37:07 EDT 2009 | abhinavajmera
I have been working on Pb-free assemblies of screw terminals (terminal blocks). Unlike, other pin-in-paste conducive components, these component has square headed leads. We have been facing issues with the solder dripping into the oven. We were able
Electronics Forum | Wed Feb 05 13:08:20 EST 2003 | joeherz
You're correct that a thicker solder deposit will make bridging on fine pitch devices a bigger risk. Another alternative could be to slightly over-print the pads (onto the soldermask) ala pin-in-paste process. Basically adding enough solder to fill
Electronics Forum | Wed Nov 19 10:47:37 EST 2014 | grahamcooper22
Probably not all the overpinted paste is flowing onto the joint. You may need a paste with great coalescence properties so it all flows together, and doesn't leave any on the resist. Does the paste drip out the through hole too ? If so it suggests it
Electronics Forum | Tue Feb 21 11:59:56 EST 2006 | dannyleach
We design a broad range of DC/DC power supplies for various telecom, internet, and computor applications and have been succesfully using intrusive reflow for ~7 years now. Our pcbs range from 0.065 to 0.090 in thickness and are moslty dense 4 to 8 la
