Electronics Forum | Fri Jun 25 03:16:38 EDT 1999 | Scott Davies
Wayne, Earl, I wish there was some way we could toss our wave solder machine forever! Unfortunately, we haven't found a way yet to do paste-in-hole reflow for large numbers of thru-hole axial and radial components, which we insert on Universal machi
Electronics Forum | Mon Jun 28 11:47:54 EDT 1999 | Christopher Cross
| | | hello, | | | | | | has anyone tried dispensing solder paste in thru holes instead of waving or hand soldering. if so how did it work out for you. | | | thanks for the input | | | | | | wayne | | | | | | | | | | | We have tried this mainly
Electronics Forum | Fri Jun 25 16:32:45 EDT 1999 | MMurphy
| | | hello, | | | | | | has anyone tried dispensing solder paste in thru holes instead of waving or hand soldering. if so how did it work out for you. | | | thanks for the input | | | | | | wayne | | | | | | | | | | | We have tried this mainly
Electronics Forum | Fri Jun 25 11:05:19 EDT 1999 | Christopher Cross
| hello, | | has anyone tried dispensing solder paste in thru holes instead of waving or hand soldering. if so how did it work out for you. | thanks for the input | | wayne | | | We have tried this mainly on thru hole connectors (.035 pins, .1 s
Electronics Forum | Fri Jun 25 12:07:00 EDT 1999 | John Thorup
| | hello, | | | | has anyone tried dispensing solder paste in thru holes instead of waving or hand soldering. if so how did it work out for you. | | thanks for the input | | | | wayne | | | | | | | We have tried this mainly on thru hole connect
Electronics Forum | Thu Jun 24 20:58:19 EDT 1999 | wayne sanita
hello, has anyone tried dispensing solder paste in thru holes instead of waving or hand soldering. if so how did it work out for you. thanks for the input wayne
Electronics Forum | Thu Jun 24 22:58:21 EDT 1999 | Earl Moon
| hello, | | has anyone tried dispensing solder paste in thru holes instead of waving or hand soldering. if so how did it work out for you. | thanks for the input | | wayne | | | Once you start, depending on applications, you'll toss your wave s
Electronics Forum | Thu Sep 04 10:24:39 EDT 2003 | paulrm
The typical PIP process is incorporated into the surface mount process. This approach requires the following: The stencil will be designed so that the correct amount of solder paste can be printed onto the through-holes to form an acceptable joint
Electronics Forum | Mon Aug 18 15:18:08 EDT 2008 | realchunks
Open the same size as the via's anular ring. Any slight off print will wet its way back into the via hole.
Electronics Forum | Mon Aug 18 13:37:23 EDT 2008 | realchunks
We do it all the time for air pressure reasons. Use a 6 mil stencil, print right on the via, aperture opening 100% same size as the via, on an 0.063" thick board. Doesn't leave a bulge and plugs the air. You can have your board house do this for y