Electronics Forum | Fri Aug 08 07:27:43 EDT 2008 | lonta96
Hi, I'm from a semiconductor package assembly, and currently looking for an offline solder paste inspector capable of true volume measurement. Any recommendation for a machine that can measure paste volume on a leadframe (metal substrate)? I found
Electronics Forum | Thu Jan 03 08:02:53 EST 2002 | davef
Slump is a function of the particular paste you select and the temperature of the paste. Use a slump test like the one that follows to compare fluxes. Slump Test Step Process activity 1 Print paste on white ceramic substrate or microscope sli
Electronics Forum | Mon May 24 13:33:46 EDT 1999 | Dave F
| We are running a number of boards with 8-10 25 mil PQFPs on board. Our process is mature with at least 3 years experiance and statistically few opens on the QFPs. Our beloved purchasing department has chased the almighty $ and changed FAB vendor
Electronics Forum | Sun Nov 07 10:54:21 EST 1999 | Steve Thomas
We're looking at redesigning our stencils to facilitate better (well, it's pretty much non-existant, so any improvement is a big leap) release from fine pitch apertures. Currently we have perpendicular walled laser cut apertures. We'll be having
Electronics Forum | Tue Nov 09 17:12:38 EST 1999 | Dave F
Steve: Addressing your points: 1 FINE PITCH APERTURES Electropolishing Laser Cut Stencils: Laser cut should not requiring polishing. Geesh, how much money do you have for stencils? ;-) Oval Shaped Apertures: Pass. What do you expect to gain f
Electronics Forum | Sat Nov 13 14:09:45 EST 1999 | se
First, let me say what I always say: a good chem-etched stencil will print fine pitch. Chem-etch brings trap to the side walls because its a physical by-product of the process. Because they are less expensive you can add electropolish and still save
Electronics Forum | Tue Mar 27 15:53:13 EST 2001 | johnw
RW, I've been printing glue by stencil for a while. Like the other guy's say there are various method's and material's that you can use but then your printing paste so the ideal is for as little change as possible to the method's your already using.
Electronics Forum | Tue Mar 27 15:53:14 EST 2001 | johnw
RW, I've been printing glue by stencil for a while. Like the other guy's say there are various method's and material's that you can use but then your printing paste so the ideal is for as little change as possible to the method's your already using.
Electronics Forum | Tue Jul 27 14:04:38 EDT 1999 | JohnW
| Looking for solder paste specification limits which have reliability data to support them. Currently, we are looking to define the min/max volume necessary to ensure a good joint on CBGA, PBGA, and Micro-BGA's. Any information will be greatly app
Electronics Forum | Wed Jul 27 09:58:05 EDT 2011 | davef
Pressure printing systems Conventional stencil printing techniques have fundamental limitations as regards paste handling: The volume of paste available for printing is limited, so frequent replenishment is necessary Paste is difficult to c
