Electronics Forum | Thu Mar 30 10:02:03 EDT 2017 | Bestglobal SMT
We have a 2008 DEK horizon 03i this machine has been a very reliable system. we are having an issue with the print being offset in the x .2mm I have run 4 different boards - same issue on all. same offset. i can print the board 10 times over and
Electronics Forum | Wed Mar 04 15:26:07 EST 2009 | clampron
Hi Jorge, Take a bare board and measure over the same pad. We have had similar issues with a higher deposition than the stencil thickness. In some cases, we have found that the top of the pad was higher than the solder mask. Our inspector uses the b
Electronics Forum | Fri Mar 16 23:38:36 EDT 2007 | mika
I don't understand so please explain in more detail. You say ~0.3mm shifted. In what direction is the paste shifted? is it shifted the very same directions on all panels? Only on this product or even with regular pcb:s? What is the size of the panel
Electronics Forum | Sat Nov 03 10:57:27 EDT 2012 | davef
EricR: Regarding "*** By the way, since we have used the Tin-Silver-Copper lead free solder there has been a strange liquid type chemical leek from the oven exhausted pipes." ... I don't know anything about your process, but the first thing I'd inve
Electronics Forum | Thu Jun 02 07:27:11 EDT 2011 | scottp
You need to post a picture or describe your geometry better. Is this a through hole via in pad or is the via offset from the pad with no soldermask in between?
Electronics Forum | Thu Oct 02 12:22:26 EDT 2008 | JerryS
Hello Ok there is not much info here. What you have to mae sure of is several key factors. 1. Have you entered the correct stencil thickness. 2. Are you using the stencil gerber (not the paste layer) The paste layer is usually not adjusted for ap
Electronics Forum | Sun Sep 06 03:24:31 EDT 2020 | rsatmech
Hi All, We are frequently getting tombstone in an induction component. (0102) There is no paste offset or placement offset. PCB pad design is not as per recommendation. Stencil opening is 1:1 Same part used in two locations and both the locati
Electronics Forum | Tue Apr 24 12:56:39 EDT 2001 | Steve
We are experiencing a fair amount of skewed components, mostly 0805 resistors and capacitors, during the reflow process. We have pretty much ruled out the pick-n-place and have determined that it may be happening because of variables at the paste scr
Electronics Forum | Mon Aug 02 17:31:20 EDT 2021 | emeto
You did not mention what is different in the results? Is it offset? Is it amount of paste? Paste height?
Electronics Forum | Tue Dec 13 17:41:04 EST 2011 | davef
A Study Of 0201’s And Tombstoning In Lead-Free Systems, Phase II Comparison Of Final Finishes And Solder Paste Formulations http://sheaengineering.com/Documents/APEX%2008%200201s%20and%20Tombstoning%20phase%202%20paper.pdf CONCLUSION The condition
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